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AMIS30543C5431RG

Onsemi

AMIS30543C5431RG by Onsemi

AMIS30543C5431RG by Onsemi is a Motion Control IC with 32 terminals, operating voltage of 6-30V, and output current of 3A. Ideal for automotive applications, it features a compact square package shape and operates in temperatures ranging from -40 to 125°C.

Median Price

$9.335

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1,498 parts In-Stock

1+ parts

$7.360

100+ parts

$5.510

1k+ parts

$4.180

10k+ parts

-

1,498

$7.360

$5.510

$4.180

-

Element14

Singapore . 1,498 parts In-Stock

1+ parts

$11.310

100+ parts

$8.470

1k+ parts

$6.430

10k+ parts

$6.180

1,498

$11.310

$8.470

$6.430

$6.180

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 32,500 parts In-Stock

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-

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32,500

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Chip Stock

USA . 28,000 parts In-Stock

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28,000

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VNN

France . 8,855 parts In-Stock

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8,855

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Digiode

USA . 1,185 parts In-Stock

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1,185

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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Vyrian

USA . 893 parts In-Stock

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893

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Distributors (Availability)

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Ampacity Inc.

Singapore . 951 parts In-Stock

1+ parts

$5.500

100+ parts

-

1k+ parts

-

10k+ parts

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951

$5.500

-

-

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$6.616

100+ parts

$6.021

1k+ parts

$5.425

10k+ parts

-

2,000

$6.616

$6.021

$5.425

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Corohmni

South Africa . 170 parts In-Stock

1+ parts

$20.387

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170

$20.387

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AZTECH Wire

Italy . 893 parts In-Stock

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$20.860

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893

$20.860

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Perfect Parts

USA . 21,650 parts In-Stock

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TANS Electronics

Latvia . 6,982 parts In-Stock

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6,982

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Problanco Electronics

Mexico . 5,383 parts In-Stock

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Continental Prestige Electronics

USA . 4,349 parts In-Stock

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SupplyDigital Components

Austria . 4,007 parts In-Stock

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4,007

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Kepictronics

USA . 2,460 parts In-Stock

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2,460

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Corphita

USA . 2,079 parts In-Stock

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2,079

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Kulean Microsystems

USA . 1,591 parts In-Stock

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1,591

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Argo Parts USA

USA . 1,353 parts In-Stock

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1,353

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Microchip USA

USA . 371 parts In-Stock

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371

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

1+ parts

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100+ parts

$2.135

1k+ parts

$1.977

10k+ parts

$1.977

250

-

$2.135

$1.977

$1.977

UHIMA Technologies

Türkiye . 174 parts In-Stock

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174

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock precision and efficiency with the AMIS30543C5431RG by Onsemi. This motion control IC offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. With its advanced features and innovative design, this product ensures seamless operation and optimal performance. Experience the value and benefits of superior motion control technology with the AMIS30543C5431RG - a game-changer in the industry.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy integration onto PCBs, making it a convenient choice for manufacturers looking to streamline their production processes.

Nominal Supply Voltage (Vsup): 12 V

The nominal supply voltage of 12 V provides a reliable power source for the motion control IC, ensuring consistent performance.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style of chip carrier with heat sink/slug and very thin profile helps in efficient heat dissipation, making the IC suitable for applications where thermal management is crucial.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this IC can withstand harsh environmental conditions, making it ideal for automotive applications.

Maximum Output Current: 3 A

The high maximum output current of 3 A allows the IC to drive powerful stepper motors, making it suitable for applications that require precise and robust motion control.

Technical Specifications

Motion Control ICs AMIS30543C5431RG attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

Length:

7 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5,6/30

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

12 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7 mm

Trade Compliance

AMIS30543C5431RG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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