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AMIS30532C53212G

Onsemi

AMIS30532C53212G by Onsemi

AMIS30532C53212G by Onsemi is a Motion Control IC with 32 terminals, operating voltage range of 6-30V. It features a max output current of 1.6A and operates in automotive temperature grade (-40 to 125 °C). Ideal for stepper motor control applications due to its compact square package shape and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,724 parts In-Stock

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Vyrian

USA . 1,627 parts In-Stock

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1,627

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Distributors (Availability)

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Native Components

USA . 644 parts In-Stock

1+ parts

$0.247

100+ parts

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$0.237

644

$0.247

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$0.237

Northwest PG Solutions

USA . 1,292 parts In-Stock

1+ parts

$0.271

100+ parts

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$0.239

1,292

$0.271

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$0.239

SupplyDigital Components

Austria . 6,084 parts In-Stock

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6,084

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Corphita

USA . 2,485 parts In-Stock

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TANS Electronics

Latvia . 2,102 parts In-Stock

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Problanco Electronics

Mexico . 1,752 parts In-Stock

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Kulean Microsystems

USA . 1,553 parts In-Stock

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Corohmni

South Africa . 218 parts In-Stock

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UHIMA Technologies

Türkiye . 82 parts In-Stock

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Overview

Unlock precision motion control with the AMIS30532C53212G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. Designed for a wide range of applications, this motion control IC offers seamless integration and high performance. Experience the value of smooth operation and accurate control with this innovative solution. Elevate your projects with the advantages and benefits that the AMIS30532C53212G brings to the table.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product convenient for mass production.

Package Shape: SQUARE

The square package shape allows for easy placement on the PCB and efficient use of board space.

Nominal Supply Voltage (Vsup): 12 V

The 12V supply voltage provides a standard power requirement for various applications, making this product versatile.

No. of Terminals: 32

The high number of terminals allows for flexibility in connectivity and control options, giving this product a wide range of applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in harsh environments, making this product suitable for demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold temperatures, increasing the product's suitability for a variety of environments.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options provide flexibility in thermal management and space constraints, making this product adaptable to different design requirements.

Terminal Position: QUAD

The quad terminal position enables efficient routing and connection of signals, enhancing the product's ease of use and reliability.

Maximum Seated Height: 0.9 mm

The low maximum seated height allows for compact designs and minimizes the overall size of the product, making it ideal for space-constrained applications.

Width (mm): 7 mm

The compact width of 7mm allows for easy integration into PCB layouts and compact designs, enhancing the product's versatility.

Other IC type: STEPPER MOTOR CONTROLLER

Being a stepper motor controller, this product is specifically designed for precise control of stepper motors, making it an ideal choice for motion control applications.

Minimum Supply Voltage (Vsup): 6 V

The low minimum supply voltage of 6V allows for operation in low-power situations while maintaining reliable performance, increasing the product's flexibility.

Length: 7 mm

The compact length of 7mm facilitates space-efficient designs and enables easy integration into existing systems, making this product a versatile option.

Temperature Grade: AUTOMOTIVE

Designed with automotive-grade components, this product is suitable for use in automotive applications, ensuring reliability and durability in harsh conditions.

Maximum Output Current: 1.6 A

The high maximum output current of 1.6A allows for driving high-power stepper motors, providing precise and reliable motion control capabilities.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and reduces the risk of soldering issues, making this product easy to work with.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density PCB layout designs, increasing the product's compatibility with modern electronics.

Maximum Supply Voltage (Vsup): 30 V

The high maximum supply voltage of 30V allows for operation in high-power applications, enhancing the product's versatility and scalability.

Technical Specifications

Motion Control ICs AMIS30532C53212G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

Length:

7 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.6 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7 mm

Trade Compliance

AMIS30532C53212G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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