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AMIS30522C5222G

Onsemi

AMIS30522C5222G by Onsemi

AMIS30522C5222G by Onsemi is a Motion Control IC with 32 terminals, operating voltage of 6-29V, and max output current of 1.6A. Ideal for automotive applications due to its temp range of -40 to 125 °C and terminal finish in Tin (Sn).

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

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Digiode

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Native Components

USA . 979 parts In-Stock

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Northwest PG Solutions

USA . 1,777 parts In-Stock

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AZTECH Wire

Italy . 717 parts In-Stock

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Component Stockers USA

USA . 421 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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TANS Electronics

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UHIMA Technologies

Türkiye . 859 parts In-Stock

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SupplyDigital Components

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Corohmni

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Microchip USA

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Overview

Unlock the power of precise motion control with the AMIS30522C5222G by Onsemi. As a leader in motion control ICs, Onsemi delivers top-quality products that guarantee reliability and performance. Ideal for applications in automotive and industrial sectors, this stepper motor controller offers unparalleled value with its advanced features and wide supply voltage range. Say goodbye to compromised efficiency and hello to seamless operation with the AMIS30522C5222G - the ultimate solution for all your motion control needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and convenient installation on a circuit board, saving space and making assembly more efficient.

Nominal Supply Voltage (Vsup): 12 V

A 12V supply voltage is compatible with many common power sources, making it easy to integrate this motion control IC into existing systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this motion control IC is suitable for use in a wide range of environments and applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this motion control IC can withstand cold temperatures and operate reliably in harsh conditions.

Maximum Output Current: 1.6 A

The high maximum output current of 1.6A makes this motion control IC suitable for driving stepper motors and other loads with higher current requirements.

Technical Specifications

Motion Control ICs AMIS30522C5222G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO NEEDS 4.5V TO 5.25V LOGIC SUPPLY

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.6 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,6.5/29

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7 mm

Trade Compliance

AMIS30522C5222G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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