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AMIS30521C5212RG

Onsemi

AMIS30521C5212RG by Onsemi

AMIS30521C5212RG by Onsemi is a Motion Control IC with 32 terminals, operating voltage of 6-30V, and max output current of 1.6A. Ideal for automotive applications due to its temp range of -40 to 125 °C and terminal finish of matte tin.

Median Price

$12.500

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Component Sense

UK . 800 parts In-Stock

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$12.500

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$11.770

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Vyrian

USA . 4,357 parts In-Stock

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Flip Electronics

USA . 2,500 parts In-Stock

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Digiode

USA . 1,189 parts In-Stock

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ComSIT Distribution GmbH

Germany . 112 parts In-Stock

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ComSIT USA

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Distributors (Availability)

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Native Components

USA . 154 parts In-Stock

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$0.112

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$0.107

154

$0.112

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$0.107

Northwest PG Solutions

USA . 1,097 parts In-Stock

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$0.123

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$0.108

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$0.123

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$0.108

Corohmni

South Africa . 186 parts In-Stock

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$12.500

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186

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$16.272

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$16.110

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$15.459

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500

$16.272

$16.110

$15.459

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AZTECH Wire

Italy . 967 parts In-Stock

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$19.360

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Perfect Parts

USA . 53,125 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,670 parts In-Stock

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Kulean Microsystems

USA . 7,770 parts In-Stock

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TANS Electronics

Latvia . 7,299 parts In-Stock

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SupplyDigital Components

Austria . 6,905 parts In-Stock

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Kepictronics

USA . 5,500 parts In-Stock

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Problanco Electronics

Mexico . 5,137 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,773 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,182 parts In-Stock

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Corphita

USA . 2,364 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 783 parts In-Stock

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Futuretech Components

Singapore . 619 parts In-Stock

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Microchip USA

USA . 352 parts In-Stock

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Overview

Enhance your motion control systems with the AMIS30521C5212RG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products for various applications. This surface-mount IC offers unparalleled value with its advanced features and benefits. Perfect for stepper motor controllers, this compact chip carrier with a very thin profile ensures efficient operation even in automotive environments. Trust Onsemi to provide reliable solutions that optimize performance and deliver seamless motion control. Elevate your projects with the AMIS30521C5212RG today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort in assembly.

Package Shape: SQUARE

Square package shape is commonly used for integrated circuits, providing a compact and standardized form factor for easy integration into various applications.

Nominal Supply Voltage (Vsup): 12 V

Suitable voltage supply range for stable operation and compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and performance in demanding industrial or automotive environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and protects the terminals from oxidation, ensuring long-term reliability in use.

Width (mm): 7 mm

Compact width dimension allows for space-saving design and integration in tight spaces or small-scale applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures durability and performance in harsh operating conditions, making it suitable for automotive applications.

Maximum Output Current: 1.6 A

High output current rating allows for driving of stepper motors or other actuators with sufficient power, enabling precise motion control.

Technical Specifications

Motion Control ICs AMIS30521C5212RG attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO NEEDS 4.5V TO 5.25V VDD SUPPLY

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.6 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,6/30

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

AMIS30521C5212RG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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