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AMIS30532C5321G

Onsemi

AMIS30532C5321G by Onsemi

AMIS30532C5321G by Onsemi is a Motion Control IC with 32 terminals, operating voltage range of 6-30V. It features a max output current of 1.6A and operates in automotive temperature grade (-40 to 125 °C). Ideal for stepper motor control applications due to its compact square package design and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,900 parts In-Stock

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2,900

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Digiode

USA . 93 parts In-Stock

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Native Components

USA . 114 parts In-Stock

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$0.121

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$0.116

114

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$0.116

Northwest PG Solutions

USA . 1,199 parts In-Stock

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$0.133

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$0.118

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$0.133

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$0.118

AZTECH Wire

Italy . 265 parts In-Stock

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$21.920

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265

$21.920

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Component Stockers USA

USA . 361 parts In-Stock

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$99.990

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361

$99.990

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TANS Electronics

Latvia . 6,225 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,632 parts In-Stock

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Kulean Microsystems

USA . 1,915 parts In-Stock

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UHIMA Technologies

Türkiye . 965 parts In-Stock

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SupplyDigital Components

Austria . 895 parts In-Stock

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Corohmni

South Africa . 336 parts In-Stock

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336

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Problanco Electronics

Mexico . 267 parts In-Stock

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Corphita

USA . 246 parts In-Stock

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Microchip USA

USA . 171 parts In-Stock

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Overview

Enhance your motion control systems with the AMIS30532C5321G from Onsemi. With a reputation for top-quality manufacturing, Onsemi delivers reliable products that meet the highest industry standards. This motion control IC is perfect for automotive applications, offering a wide range of benefits such as precise control, efficient performance, and easy integration. Upgrade your systems with this surface-mount IC and experience the value and advantages it brings to your projects. Trust Onsemi for all your motion control needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing manufacturing costs.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal supply voltage of 12V provides a good balance between power efficiency and performance for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style with heat sink/slug and very thin profile helps in efficient heat dissipation and compact design, making it suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product is suitable for demanding industrial and automotive applications where higher temperatures may be encountered.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this product suitable for use in harsh environments or cold storage applications.

Maximum Output Current: 1.6 A

The high maximum output current capability of 1.6A ensures reliable and efficient control of stepper motors, making it suitable for driving various types of loads.

Technical Specifications

Motion Control ICs AMIS30532C5321G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

7 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.6 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

AMIS30532C5321G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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