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AMIS30621C6216RG

Onsemi

AMIS30621C6216RG by Onsemi

AMIS30621C6216RG by Onsemi is a Motion Control IC with 32 terminals, operating voltage range of 6.5-29V, and max supply current of 10mA. Ideal for stepper motor control applications due to its compact square package shape and low seated height of 0.9mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 59,000 parts In-Stock

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Vyrian

USA . 4,518 parts In-Stock

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Digiode

USA . 1,566 parts In-Stock

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AZTECH Wire

Italy . 860 parts In-Stock

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$9.460

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860

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QUARKTWIN TECHNOLOGY LTD

USA . 14,685 parts In-Stock

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SupplyDigital Components

Austria . 6,606 parts In-Stock

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TANS Electronics

Latvia . 4,687 parts In-Stock

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Kepictronics

USA . 4,660 parts In-Stock

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Northwest PG Solutions

USA . 2,111 parts In-Stock

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Problanco Electronics

Mexico . 1,935 parts In-Stock

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Corphita

USA . 1,093 parts In-Stock

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Native Components

USA . 508 parts In-Stock

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Kulean Microsystems

USA . 350 parts In-Stock

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Corohmni

South Africa . 277 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 26 parts In-Stock

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Overview

Revolutionize your motion control systems with the AMIS30621C6216RG by Onsemi. As a leader in the industry, Onsemi delivers top-quality products that exceed expectations. The AMIS30621C6216RG is a surface-mount IC perfect for various applications such as stepper motor controllers. With a wide range of power supplies, low supply voltage, and compact package style, this IC offers unmatched value and benefits to customers. Upgrade your motion control systems today with the AMIS30621C6216RG and experience seamless performance like never before.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, making it a convenient choice for manufacturers.

Package Shape: SQUARE

The square shape helps in efficient space utilization on the PCB, ideal for applications where space is limited.

Nominal Supply Voltage (Vsup): 8 V

The specified supply voltage ensures stable and reliable operation of the motion control IC.

Power Supplies (V): 6.5/29

Support for power supplies ranging from 6.5V to 29V offers flexibility for a wide range of applications.

No. of Terminals: 32

The high number of terminals allows for connectivity to various external components, enhancing functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style with a heat sink/slug design and very thin profile helps in efficient heat dissipation and overall compactness.

Terminal Finish: TIN

Tin terminal finish ensures good electrical conductivity and solderability.

Terminal Position: QUAD

Quad terminal position simplifies the PCB layout and improves signal integrity.

Maximum Seated Height: 0.9 mm

Low seated height makes it suitable for applications with height constraints, ensuring a compact design.

Width (mm): 7 mm

Narrow width allows for easy integration into space-constrained PCB layouts.

Other IC type: STEPPER MOTOR CONTROLLER

Designed specifically for stepper motor control, ensuring optimized performance for motion control applications.

Minimum Supply Voltage (Vsup): 6.5 V

Support for a minimum supply voltage of 6.5V ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

With a peak reflow temperature of 260 °C and maximum reflow time of 30 seconds, it offers robust solder joint reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures proper soldering and reliability during the assembly process.

Length: 7 mm

Compact length allows for flexible placement on the PCB, enabling efficient board design.

Maximum Supply Current (Isup): 10 mA

Low maximum supply current consumption of 10mA helps in reducing power consumption for energy-efficient operation.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm enables dense packing on the PCB, enhancing design flexibility.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates good moisture resistance during storage and handling.

Maximum Supply Voltage (Vsup): 29 V

Support for a maximum supply voltage of 29V allows for compatibility with a wide range of power sources and applications.

Technical Specifications

Motion Control ICs AMIS30621C6216RG attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

6.5/29

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

6.5 V

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

AMIS30621C6216RG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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