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AMIS30542C5421RG

Onsemi

AMIS30542C5421RG by Onsemi

AMIS30542C5421RG by Onsemi is a Motion Control IC with 32 terminals, operating voltage range of 6-30V. It features a max output current of 3.2A, suitable for automotive applications due to its high temperature grade and compact square package design.

Median Price

$3.400

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 7,500 parts In-Stock

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$3.400

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7,500

$3.400

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Chip Stock

USA . 46,000 parts In-Stock

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46,000

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Vyrian

USA . 5,595 parts In-Stock

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5,595

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Digiode

USA . 1,907 parts In-Stock

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1,907

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Distributors (Availability)

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Native Components

USA . 293 parts In-Stock

1+ parts

$0.545

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293

$0.545

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Northwest PG Solutions

USA . 1,416 parts In-Stock

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$0.600

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1,416

$0.600

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AZTECH Wire

Italy . 926 parts In-Stock

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$14.610

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926

$14.610

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Component Stockers USA

USA . 619 parts In-Stock

1+ parts

$99.990

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619

$99.990

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SupplyDigital Components

Austria . 7,926 parts In-Stock

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7,926

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TANS Electronics

Latvia . 7,498 parts In-Stock

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7,498

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Kepictronics

USA . 6,680 parts In-Stock

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6,680

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Kulean Microsystems

USA . 2,025 parts In-Stock

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2,025

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Problanco Electronics

Mexico . 1,613 parts In-Stock

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1,613

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UHIMA Technologies

Türkiye . 671 parts In-Stock

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671

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Corphita

USA . 487 parts In-Stock

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487

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Corohmni

South Africa . 395 parts In-Stock

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395

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Microchip USA

USA . 269 parts In-Stock

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269

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Overview

Unlock the power of precise motion control with the AMIS30542C5421RG by Onsemi. Crafted with expert precision and unparalleled quality, this Motion Control IC is designed to deliver seamless performance in a variety of applications. From automotive systems to industrial automation, this product offers unmatched reliability and efficiency. Experience the value of cutting-edge technology and elevate your projects with the AMIS30542C5421RG - where innovation meets excellence.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, reducing production time and costs.

Nominal Supply Voltage (Vsup): 12 V

Optimal voltage for powering the device, ensuring stable performance.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a variety of industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments without any issues.

Maximum Output Current: 3.2 A

Capable of driving high current loads, making it suitable for demanding applications.

Technical Specifications

Motion Control ICs AMIS30542C5421RG attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3.2 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

AMIS30542C5421RG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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