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AMIS30421C4211G

Onsemi

AMIS30421C4211G by Onsemi

AMIS30421C4211G by Onsemi is a Motion Control IC with 44 terminals in a square chip carrier package. It operates b/w -40 to 125 °C, suitable for automotive applications. Features include stepper motor control, 6-30V supply voltage range, and compact dimensions of 7x7mm.

Median Price

$7.040

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 30 parts In-Stock

1+ parts

$7.040

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30

$7.040

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Chip Stock

USA . 64,000 parts In-Stock

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64,000

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Vyrian

USA . 8,827 parts In-Stock

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8,827

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Digiode

USA . 1,849 parts In-Stock

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1,849

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Distributors (Availability)

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Native Components

USA . 532 parts In-Stock

1+ parts

$0.349

100+ parts

-

1k+ parts

-

10k+ parts

$0.335

532

$0.349

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-

$0.335

Northwest PG Solutions

USA . 749 parts In-Stock

1+ parts

$0.383

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-

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$0.338

749

$0.383

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$0.338

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$4.542

100+ parts

$4.133

1k+ parts

$3.724

10k+ parts

-

600

$4.542

$4.133

$3.724

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Corohmni

South Africa . 429 parts In-Stock

1+ parts

$11.901

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429

$11.901

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AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$12.690

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786

$12.690

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Kulean Microsystems

USA . 6,609 parts In-Stock

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6,609

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TANS Electronics

Latvia . 6,282 parts In-Stock

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6,282

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Problanco Electronics

Mexico . 4,627 parts In-Stock

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4,627

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SupplyDigital Components

Austria . 1,113 parts In-Stock

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Corphita

USA . 615 parts In-Stock

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615

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UHIMA Technologies

Türkiye . 535 parts In-Stock

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535

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Perfect Parts

USA . 491 parts In-Stock

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491

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Microchip USA

USA . 429 parts In-Stock

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429

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unlock the power of precise motion control with the AMIS30421C4211G by Onsemi. Crafted with cutting-edge technology and precision engineering, this stepper motor controller offers unparalleled quality and reliability. Ideal for automotive applications, this surface-mount IC boasts a compact square shape and a wide temperature operating range. With 44 terminals and advanced features, this motion control IC provides exceptional value and performance to customers seeking seamless automation solutions. Elevate your projects with the AMIS30421C4211G and experience the difference that superior manufacturing and innovative design can make.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy PCB assembly and saves space on the board.

Package Shape: SQUARE

Square package shape provides better thermal performance and easier handling during assembly.

No. of Terminals: 44

Having 44 terminals allows for more connectivity options and flexibility in design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers excellent heat dissipation, compact size, and low profile which is beneficial for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and ensure reliable performance.

Minimum Operating Temperature: -40 °C

A wide range of operating temperatures allows for use in both extreme cold and hot environments.

Terminal Position: QUAD

Quad terminal position provides efficient routing of connections and simplifies PCB layout.

Maximum Seated Height: 0.9 mm

Low seated height saves space in the design and enables sleek and compact end products.

Width (mm): 7 mm

Narrow width allows for placement in tight spaces on the PCB and reduces the overall size of the final product.

Other IC type: STEPPER MOTOR CONTROLLER

Being a stepper motor controller makes this IC suitable for precise motion control applications and robotics.

Minimum Supply Voltage (Vsup): 6 V

Low minimum supply voltage allows for energy-efficient operation and compatibility with a wide range of power sources.

Length: 7 mm

Compact length enables easy integration into small devices and systems.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable operation in automotive applications where temperature fluctuations are common.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations.

Terminal Pitch: 0.5 mm

Fine pitch terminals allow for high-density mounting on the PCB and reduce overall footprint of the device.

Maximum Supply Voltage (Vsup): 30 V

High maximum supply voltage provides flexibility in power supply options and ensures compatibility with various systems.

Technical Specifications

Motion Control ICs AMIS30421C4211G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N44

Length:

7 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7 mm

Trade Compliance

AMIS30421C4211G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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