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AFGB30T65SQDN

Onsemi

AFGB30T65SQDN by Onsemi

AFGB30T65SQDN by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.1V and a max IC of 60A, ideal for power control applications. Featuring a single configuration with built-in diode, it has a package style of small outline and can operate b/w -55 to 175 °C. Suitable for surface mount assembly, this transistor offers fast turn-off time (toff) of 78.7ns and turn-on time (ton) of 33.6ns, meeting AEC-Q101 standards.

Median Price

$4.765

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Mouser Electronics

USA . 1,569 parts In-Stock

1+ parts

$3.960

100+ parts

$2.670

1k+ parts

$2.190

10k+ parts

$2.110

1,569

$3.960

$2.670

$2.190

$2.110

DigiKey

USA . 732 parts In-Stock

1+ parts

$5.570

100+ parts

$2.666

1k+ parts

$2.118

10k+ parts

$2.116

732

$5.570

$2.666

$2.118

$2.116

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.755

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500

$2.755

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Chip Stock

USA . 4,600 parts In-Stock

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4,600

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Digiode

USA . 904 parts In-Stock

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904

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Vyrian

USA . 278 parts In-Stock

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278

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VNN

France . 50 parts In-Stock

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50

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Distributors (Availability)

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Corohmni

South Africa . 359 parts In-Stock

1+ parts

$2.700

100+ parts

-

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359

$2.700

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Continental Prestige Electronics

USA . 4,068 parts In-Stock

1+ parts

$2.755

100+ parts

-

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$2.700

4,068

$2.755

-

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$2.700

Argo Parts USA

USA . 1,706 parts In-Stock

1+ parts

$2.755

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1,706

$2.755

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Netroflash

USA . 50 parts In-Stock

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$2.755

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50

$2.755

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Andel Nordic

Denmark . 3,468 parts In-Stock

1+ parts

$12.250

100+ parts

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$8.575

10k+ parts

$8.575

3,468

$12.250

-

$8.575

$8.575

AZTECH Wire

Italy . 278 parts In-Stock

1+ parts

$13.919

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278

$13.919

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Ampacity Inc.

Singapore . 1,406 parts In-Stock

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$63.050

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$63.050

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Microchip USA

USA . 11,585 parts In-Stock

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11,585

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SupplyDigital Components

Austria . 5,154 parts In-Stock

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iodParts Technologies Inc.

India . 4,397 parts In-Stock

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TANS Electronics

Latvia . 3,539 parts In-Stock

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3,539

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,258 parts In-Stock

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2,258

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Kulean Microsystems

USA . 831 parts In-Stock

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831

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Corphita

USA . 557 parts In-Stock

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557

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UHIMA Technologies

Türkiye . 117 parts In-Stock

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Overview

Experience the power of innovation with the AFGB30T65SQDN by Onsemi, a leading manufacturer in the industry of Insulated Gate Bipolar Transistors (IGBT). This N-CHANNEL transistor offers exceptional performance in power control applications, with a single configuration and built-in diode for added convenience. The AFGB30T65SQDN's high quality construction and advanced technology ensure reliable operation and efficiency. Trust Onsemi to deliver top-notch products that exceed expectations. Unlock new possibilities and elevate your projects with the AFGB30T65SQDN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable in various environments.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher current-carrying capacity compared to P-channel IGBTs, making them more efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for simplified circuit design and can protect against reverse voltage spikes, enhancing the overall performance of the product.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and efficiency in managing high power levels.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Maximum VCEsat: 2.1 V

Low VCEsat value indicates minimal voltage drop when the transistor is in the on-state, resulting in lower power dissipation and improved efficiency.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used for IGBTs, providing compatibility with standard mounting techniques and ensuring easy integration into existing systems.

Terminal Form: GULL WING

Gull wing terminals offer secure and reliable connections on the circuit board, enhancing the overall robustness of the product.

Nominal Turn Off Time (toff): 78.7 ns

Fast turn-off time helps in reducing switching losses and improving the efficiency of power control applications.

No. of Terminals: 2

Having only 2 terminals simplifies the circuit design and installation process, making the product user-friendly.

Maximum Power Dissipation (Abs): 220 W

High power dissipation capacity allows the product to handle large power levels without overheating or performance degradation.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and facilitates compact designs, ideal for applications with limited space constraints.

Maximum Operating Temperature: 175 °C

Wide operating temperature range ensures the product can function reliably in varying environmental conditions without overheating.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating allows the product to handle high voltage levels, making it suitable for high-power applications.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, providing excellent performance and durability.

Maximum Gate-Emitter Voltage: 30 V

High gate-emitter voltage rating ensures reliable operation of the transistor's control mechanism, enhancing the overall stability of the product.

Minimum Operating Temperature: -55 °C

Wide temperature range allows the product to operate in extreme cold conditions without compromising performance.

Maximum Collector Current (IC): 60 A

High collector current rating enables the product to handle large current loads, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage ensures efficient and reliable control of the transistor, improving the overall performance of the product.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: SINGLE

Single terminal position simplifies the installation process and ensures consistent and reliable connections within the circuit.

Case Connection: COLLECTOR

Collector case connection allows for efficient heat dissipation and ensures the product can operate at high power levels without overheating.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes the exposure of internal components to high temperatures, reducing the risk of damage during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering of the terminals and good overall reliability of the product.

Nominal Turn On Time (ton): 33.6 ns

Fast turn-on time enhances the responsiveness of the transistor, allowing for quick and precise control in power management applications.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures high quality and reliability, making the product suitable for automotive and other demanding applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGB30T65SQDN attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

30 V

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

78.7 ns

Nominal Turn On Time (ton):

33.6 ns

Maximum VCEsat:

2.1 V

Trade Compliance

AFGB30T65SQDN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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