Loading...

AFGB30T65SQDN-BW

Onsemi

AFGB30T65SQDN-BW by Onsemi

AFGB30T65SQDN-BW by Onsemi is an N-CHANNEL IGBT with 650V VCEsat, 60A IC, and 2.1V VCE. Ideal for power control applications, it features a built-in diode and operates b/w -55 to 175 °C.

Median Price

$2.882

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,356 parts In-Stock

1+ parts

$2.882

100+ parts

-

1k+ parts

-

10k+ parts

-

2,356

$2.882

-

-

-

Digiode

USA . 65 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

65

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 424 parts In-Stock

1+ parts

$2.882

100+ parts

-

1k+ parts

-

10k+ parts

-

424

$2.882

-

-

-

Native Components

USA . 836 parts In-Stock

1+ parts

$11.734

100+ parts

-

1k+ parts

-

10k+ parts

-

836

$11.734

-

-

-

Northwest PG Solutions

USA . 598 parts In-Stock

1+ parts

$12.908

100+ parts

$11.617

1k+ parts

-

10k+ parts

-

598

$12.908

$11.617

-

-

SupplyDigital Components

Austria . 8,086 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,086

-

-

-

-

TANS Electronics

Latvia . 7,983 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,983

-

-

-

-

Kulean Microsystems

USA . 6,032 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,032

-

-

-

-

Corphita

USA . 721 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

721

-

-

-

-

Problanco Electronics

Mexico . 67 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

67

-

-

-

-

UHIMA Technologies

Türkiye . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12

-

-

-

-

Overview

Elevate your power control applications with the AFGB30T65SQDN-BW by Onsemi. As a trusted manufacturer in the industry of Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers quality and reliability in every product. With its N-CHANNEL configuration, built-in diode, and high maximum collector-emitter voltage of 650V, this transistor is perfect for various power control needs. Experience the benefits of fast turn-on/off times, low VCEsat, and high power dissipation capability up to 220W. Trust Onsemi for exceptional performance and efficiency in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the components inside, making it a durable choice for power control applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for high efficiency and fast switching capabilities, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps with freewheeling and can improve overall system efficiency in power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in managing power flow.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying the assembly process.

Maximum VCEsat: 2.1 V

Low VCEsat results in lower power losses and higher efficiency in power control applications.

Package Shape: RECTANGULAR

Rectangular shape provides efficient space utilization and easy integration into existing systems.

Terminal Form: GULL WING

Gull wing terminals offer strong mechanical support and easy soldering during assembly.

Nominal Turn Off Time (toff): 78.7 ns

Fast turn-off time ensures quick response and effective control over power flow.

No. of Terminals: 2

Simplified design with only two terminals reduces complexity in circuit connections.

Maximum Power Dissipation (Abs): 220 W

High power dissipation capacity allows for handling large power loads without overheating.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space and enables efficient PCB layout designs in power control applications.

Maximum Operating Temperature: 175 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Maximum Collector-Emitter Voltage: 650 V

High VCE voltage rating makes it suitable for high-power applications requiring higher voltage handling capabilities.

Transistor Element Material: SILICON

Silicon-based transistor element offers good performance and reliability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating ensures safe and reliable operation in power control circuits.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in extreme cold conditions, ensuring versatility in usage.

Maximum Collector Current (IC): 60 A

High collector current rating enables handling of large current flows in power control applications.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage ensures efficient switching and control over power flow.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and ensures reliable electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies circuit connections and reduces chances of wiring errors.

Case Connection: COLLECTOR

Collector case connection facilitates efficient heat dissipation and thermal management in power control applications.

Maximum Time At Peak Reflow Temperature (s): 30

Safely withstands peak reflow temperatures for a specific duration during soldering process.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures reliable solder joints during assembly.

Nominal Turn On Time (ton): 33.6 ns

Fast turn-on time ensures quick response and efficient power control operation.

Reference Standard: AEC-Q101

Complies with automotive quality standards, ensuring reliability and durability for automotive power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGB30T65SQDN-BW attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

78.7 ns

Nominal Turn On Time (ton):

33.6 ns

Maximum VCEsat:

2.1 V

Trade Compliance

AFGB30T65SQDN-BW Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 6