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AFGB20N60SFD-BW

Onsemi

AFGB20N60SFD-BW by Onsemi

AFGB20N60SFD-BW by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.85V and IC of 40A. Ideal for SWITCHING applications, it has a tr of 21ns and tf of 43ns, operating b/w -55 to 150 °C.

Median Price

$3.017

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 803 parts In-Stock

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Digiode

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Corohmni

South Africa . 80 parts In-Stock

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Problanco Electronics

Mexico . 5,790 parts In-Stock

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TANS Electronics

Latvia . 5,261 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

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Kulean Microsystems

USA . 4,197 parts In-Stock

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Northwest PG Solutions

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Corphita

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UHIMA Technologies

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Overview

Discover the cutting-edge AFGB20N60SFD-BW IGBT by Onsemi, a game-changer in the field of insulated gate bipolar transistors. With a focus on quality and reliability, Onsemi delivers top-notch components for various switching applications. This single-channel device with a built-in diode offers superior performance, efficient power dissipation, and a wide operating temperature range. Ideal for demanding industrial environments, this IGBT ensures seamless operation and long-term functionality. Upgrade your systems with Onsemi's AFGB20N60SFD-BW for unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides good insulation and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL type offers high efficiency and lower on-state resistance, making it ideal for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making the product more cost-effective.

Transistor Application: SWITCHING

Designed for switching applications, this IGBT ensures fast and efficient power switching.

Maximum Rise Time (tr): 21 ns

Fast rise time ensures quick response and minimal switching losses, improving overall performance.

Maximum VCEsat: 2.85 V

Low VCEsat voltage reduces power dissipation and improves efficiency of the transistor.

Maximum Power Dissipation (Abs): 208 W

With high power dissipation capacity, this IGBT can handle significant amounts of power, making it suitable for high-power applications.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating allows for operation in high voltage circuits, expanding the range of applications.

Minimum Operating Temperature: -55 °C

Wide operating temperature range enables the IGBT to work in various environmental conditions, increasing its versatility.

Maximum Collector Current (IC): 40 A

High collector current rating allows the IGBT to handle large currents, making it suitable for high-power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGB20N60SFD-BW attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

43 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Maximum Rise Time (tr):

21 ns

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

169 ns

Nominal Turn Off Time (toff):

123 ns

Maximum Turn On Time (ton):

37 ns

Nominal Turn On Time (ton):

28 ns

Maximum VCEsat:

2.85 V

Trade Compliance

AFGB20N60SFD-BW Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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