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3SK263

Onsemi

3SK263 by Onsemi

3SK263 by Onsemi is a N-CHANNEL FET with max drain current of 0.03A, suitable for power applications. With single configuration and surface mount capability, it operates at up to 125 °C making it ideal for various electronic devices requiring low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,203 parts In-Stock

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Digiode

USA . 410 parts In-Stock

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Kepictronics

USA . 10,900 parts In-Stock

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Problanco Electronics

Mexico . 8,270 parts In-Stock

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SupplyDigital Components

Austria . 5,377 parts In-Stock

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Kulean Microsystems

USA . 4,171 parts In-Stock

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Northwest PG Solutions

USA . 2,120 parts In-Stock

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TANS Electronics

Latvia . 1,465 parts In-Stock

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Corphita

USA . 858 parts In-Stock

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Native Components

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Corohmni

South Africa . 113 parts In-Stock

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UHIMA Technologies

Türkiye . 73 parts In-Stock

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Overview

Unleash the power of innovation with the 3SK263 by Onsemi! Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance and reliability. Whether you're designing cutting-edge electronics or revamping existing systems, this surface-mount FET is the perfect choice. With a maximum drain current of 0.03A and a maximum operating temperature of 125 °C, the 3SK263 ensures optimal functionality in any application. Upgrade your projects today with the superior quality and advanced technology of Onsemi's 3SK263!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower on-resistance and higher switching speeds compared to P-Channel FETs, making them a good choice for high-performance applications.

Configuration: SINGLE

Single configuration FETs are easy to integrate into circuits and are commonly used in low to medium power applications, making them a versatile choice.

Surface Mount: YES

Surface mount FETs are compact and can be easily mounted on PCBs, saving space and facilitating automated assembly processes.

Maximum Drain Current (Abs) (ID): 0.03 A

With a maximum drain current of 0.03 A, this FET is suitable for low power applications where precise current control is required.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor FETs offer low gate capacitance and high input impedance, enabling efficient switching and reducing power losses.

Maximum Operating Temperature: 125 °C

The FET can operate at temperatures up to 125 °C, making it suitable for high-temperature environments and ensuring reliable performance under varying conditions.

Maximum Drain Current (ID): 0.03 A

The FET's maximum drain current of 0.03 A allows it to handle low power applications efficiently while providing reliable current flow.

Technical Specifications

Power Field Effect Transistors (FET) 3SK263 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.03 A

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

125 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

3SK263 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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