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3SK265-6

Onsemi

3SK265-6 by Onsemi

3SK265-6 by Onsemi is a N-CHANNEL FET with max drain current of 0.03A and power dissipation of 0.2W. Ideal for applications requiring single configuration, surface mount technology, and operating temperature up to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,194 parts In-Stock

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Digiode

USA . 1,009 parts In-Stock

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Native Components

USA . 336 parts In-Stock

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$0.198

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$0.190

336

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Northwest PG Solutions

USA . 460 parts In-Stock

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$0.217

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$0.192

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$0.192

SupplyDigital Components

Austria . 8,216 parts In-Stock

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Problanco Electronics

Mexico . 8,058 parts In-Stock

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TANS Electronics

Latvia . 2,984 parts In-Stock

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Corphita

USA . 2,237 parts In-Stock

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UHIMA Technologies

Türkiye . 708 parts In-Stock

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Corohmni

South Africa . 81 parts In-Stock

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Kulean Microsystems

USA . 9 parts In-Stock

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Overview

Unleash the power of innovation with the 3SK265-6 by Onsemi, a top-tier manufacturer known for delivering cutting-edge technology. This N-CHANNEL Power Field Effect Transistor (FET) offers unparalleled performance and reliability in a compact, surface mount configuration. Ideal for a wide range of applications, this FET boasts a maximum drain current of 0.03 A and a maximum power dissipation of 0.2 W, making it a versatile choice for your next project. Experience the superior quality and efficiency that Onsemi is renowned for, and take your designs to the next level with the 3SK265-6.

Feature Benefit Bullets

Polarity or Channel Type - N-CHANNEL

N-CHANNEL transistors typically have lower on-resistance and higher current-carrying capacity compared to P-CHANNEL transistors, making them suitable for high power applications.

Configuration - SINGLE

Single configuration simplifies circuit design and makes it easier to integrate into existing systems.

Surface Mount - YES

Surface mount technology allows for compact and space-saving designs, making it ideal for applications where size is a constraint.

Maximum Drain Current (Abs) (ID) - 0.03 A

With a maximum drain current of 0.03 A, this FET can handle moderate power requirements efficiently.

Maximum Power Dissipation (Abs) - 0.2 W

With a low maximum power dissipation of 0.2 W, this FET is efficient and helps in minimizing heat dissipation issues in the circuit.

Field Effect Transistor Technology - METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high efficiency and reliable performance for various power applications.

Maximum Operating Temperature - 125 °C

With a maximum operating temperature of 125 °C, this FET can operate reliably in a wide range of temperature environments.

Maximum Drain Current (ID) - 0.03 A

With a maximum drain current of 0.03 A, this FET can handle moderate power requirements efficiently.

Technical Specifications

Power Field Effect Transistors (FET) 3SK265-6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.03 A

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

125 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

3SK265-6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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