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3SK265-5

Onsemi

3SK265-5 by Onsemi

3SK265-5 by Onsemi is a N-CHANNEL FET with 0.03A max drain current and 0.2W max power dissipation. Ideal for applications requiring a single configuration SMD transistor, operating up to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 552 parts In-Stock

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Vyrian

USA . 122 parts In-Stock

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Native Components

USA . 672 parts In-Stock

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$0.142

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$0.136

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Northwest PG Solutions

USA . 1,148 parts In-Stock

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$0.156

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TANS Electronics

Latvia . 7,623 parts In-Stock

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Problanco Electronics

Mexico . 7,295 parts In-Stock

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SupplyDigital Components

Austria . 4,615 parts In-Stock

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Kulean Microsystems

USA . 4,409 parts In-Stock

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Corphita

USA . 879 parts In-Stock

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Corohmni

South Africa . 98 parts In-Stock

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UHIMA Technologies

Türkiye . 86 parts In-Stock

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Overview

Unlock the power of innovation with the Onsemi 3SK265-5 Power Field Effect Transistor. Manufactured by industry leader Onsemi, this N-channel FET offers unparalleled quality and performance. Ideal for a variety of applications, this single configuration transistor boasts advanced METAL-OXIDE SEMICONDUCTOR technology, ensuring maximum efficiency and reliability. Experience the difference with the 3SK265-5 and elevate your projects to new heights.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL - N-channel FETs typically have lower on-resistance and higher electron mobility, making them efficient for power applications.

Configuration

SINGLE - Single configuration FETs are simpler to use and control compared to multiple configuration FETs.

Surface Mount

YES - Surface mount FETs are compact and easy to mount onto circuit boards, saving space and simplifying assembly.

Maximum Drain Current (Abs) (ID)

0.03 A - This FET can handle relatively high drain currents, making it suitable for applications that require moderate power handling capabilities.

Maximum Power Dissipation (Abs)

0.2 W - This FET has a moderate power dissipation capability, suitable for low to medium power applications.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - MOSFET technology offers high efficiency and fast switching speeds, making it ideal for power applications.

Maximum Operating Temperature

125 °C - With a high maximum operating temperature, this FET is suitable for various operating environments and temperature conditions.

Maximum Drain Current (ID)

0.03 A - This spec confirms the maximum drain current capability of the FET, ensuring it can handle the required current levels without issues.

Technical Specifications

Power Field Effect Transistors (FET) 3SK265-5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.03 A

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

125 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

3SK265-5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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