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2SK3279TP-FA

Onsemi

2SK3279TP-FA by Onsemi

The Onsemi 2SK3279TP-FA is a N-CHANNEL Power FET with 15A max drain current and 20W power dissipation. It operates in enhancement mode, suitable for high-power applications. Ideal for surface mount designs, it can handle up to 150 °C operating temperature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 706 parts In-Stock

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Vyrian

USA . 595 parts In-Stock

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Native Components

USA . 492 parts In-Stock

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$0.500

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492

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Northwest PG Solutions

USA . 519 parts In-Stock

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$0.550

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$0.485

519

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Kulean Microsystems

USA . 6,381 parts In-Stock

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Problanco Electronics

Mexico . 5,197 parts In-Stock

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TANS Electronics

Latvia . 1,339 parts In-Stock

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SupplyDigital Components

Austria . 1,123 parts In-Stock

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Corphita

USA . 772 parts In-Stock

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Corohmni

South Africa . 420 parts In-Stock

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UHIMA Technologies

Türkiye . 151 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the 2SK3279TP-FA Power Field Effect Transistor from Onsemi. Known for their superior quality and reliability, Onsemi products are trusted by professionals worldwide. This N-CHANNEL FET offers enhanced performance and efficiency, making it ideal for a wide range of applications. From power supplies to motor control, this transistor delivers exceptional value and unmatched benefits to customers looking for top-notch components. Upgrade your projects today with the 2SK3279TP-FA and experience the difference Onsemi technology can make.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their low ON-state resistance, making them efficient for high power applications.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and reduces component count, making it easier to implement in applications.

Surface Mount: YES

Surface mount package enables easy and compact PCB assembly, suitable for space-constrained applications.

Operating Mode: ENHANCEMENT MODE

ENHANCEMENT MODE FETs offer high input impedance and low output impedance, improving overall circuit efficiency.

Maximum Drain Current (Abs): 15 A

With a maximum drain current of 15A, this FET can handle high power loads reliably.

Maximum Power Dissipation (Abs): 20 W

High power dissipation capability of 20W ensures the FET can operate within safe temperature limits under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

METAL-OXIDE SEMICONDUCTOR technology offers good switching performance and low gate capacitance for fast operation.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows for reliable operation in high-temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) 2SK3279TP-FA attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

2SK3279TP-FA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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