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SC26C92C1A

NXP Semiconductors

SC26C92C1A by NXP Semiconductors

SC26C92C1A by NXP Semiconductors is a Serial Communication Controller with 5V power supply, 0-70°C operating temperature range, and 0.125 MBps data transfer rate. It is used for asynchronous communication protocols in serial I/O applications requiring low power mode and 8 MHz clock frequency.

Median Price

$14.700

Lifecycle Status

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Overview

Enhance your communication systems with the SC26C92C1A by NXP Semiconductors, a leading manufacturer in the industry. This Serial Communication Controller offers unparalleled quality and reliability, opening up endless possibilities for applications in various industries. With a maximum data transfer rate of 0.125 MBps and low power mode, this product delivers exceptional performance while conserving energy. Trust NXP Semiconductors to provide cutting-edge technology that ensures seamless communication and efficiency in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes installation and integration easier and more convenient, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power inputs, accommodating a wide range of applications and power sources.

Address Bus Width: 4

With a 4-bit address bus width, this product can support a variety of different addressing schemes and configurations for efficient data management.

Package Shape: SQUARE

The square package shape enables easy placement and orientation on circuit boards, optimizing space utilization and ensuring a clean layout.

Power Supplies (V): 5

Operating at 5V power supplies makes this product compatible with common voltage standards, simplifying integration into existing systems.

No. of Terminals: 44

Having 44 terminals allows for versatile connectivity options and signal routing, enabling seamless communication with other components in the system.

Package Style (Meter): CHIP CARRIER

The chip carrier style offers a compact and efficient packaging solution, reducing the overall footprint of the product on the circuit board.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures reliable operation even in situations where power input may fluctuate or drop slightly below the nominal voltage.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high-temperature environments without compromising performance or reliability.

Maximum Data Transfer Rate: 0.125 MBps

The high maximum data transfer rate of 0.125 MBps enables fast and efficient communication, ideal for applications requiring quick data exchange.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable performance even in cold environments, making it suitable for a wide range of operating conditions.

Terminal Finish: Tin (Sn)

The use of tin as the terminal finish provides corrosion resistance and reliable electrical connections, maintaining signal integrity over time.

Terminal Position: QUAD

The quad terminal position offers a standardized layout for easy installation and connection, reducing the risk of errors during assembly.

Maximum Seated Height: 4.57 mm

With a maximum seated height of 4.57 mm, this product can be easily integrated into compact and space-constrained designs, offering versatility in placement.

Width: 16.5862 mm

The narrow width of 16.5862 mm enables efficient use of space on circuit boards, allowing for compact and streamlined system designs.

Data Encoding or Decoding Method: NRZ

Using NRZ (Non-Return-to-Zero) encoding or decoding method ensures reliable data transmission with minimal errors, leading to accurate communication between devices.

External Data Bus Width: 8

An external data bus width of 8 bits enables high-speed data transfer and processing, enhancing performance and throughput in various applications.

Communication Protocol: ASYNC, BIT

Supporting asynchronous and bit-level communication protocols enables compatibility with a wide range of devices and systems, enhancing versatility and interoperability.

Maximum Clock Frequency: 8 MHz

With a maximum clock frequency of 8 MHz, this product can handle high-speed data processing and communication tasks efficiently, meeting the requirements of demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reflow processes, optimizing manufacturing efficiency and reliability.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C allows for secure soldering connections without damaging the internal components, ensuring product integrity.

Length: 16.5862 mm

The compact length of 16.5862 mm contributes to a space-saving design, making it ideal for applications with limited board space or size constraints.

Temperature Grade: COMMERCIAL

Designed for commercial temperature grade applications, this product offers reliable performance and stability in typical operating environments.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

As a serial IO/communication controller, this product provides versatile communication capabilities and interfaces, making it suitable for a wide range of serial communication applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, resulting in efficient operation and reliable performance over extended periods.

Terminal Form: J BEND

The J bend terminal form facilitates easy and secure solder connections, ensuring robust electrical connections and preventing signal loss or interruptions.

Maximum Supply Current: 25 mA

With a maximum supply current of 25 mA, this product operates efficiently without drawing excessive power, leading to lower energy consumption and improved cost-effectiveness.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V makes this product compatible with standard power sources, simplifying integration and ensuring consistent performance.

No. of Serial I/Os: 2

Featuring 2 serial input/output ports allows for simultaneous data transfer and communication with multiple devices, enhancing connectivity and flexibility.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm enables precise and secure connections, reducing the risk of short circuits or signal interference, ensuring reliable data transmission.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand moderate exposure to moisture during storage or operation, reducing the risk of damage or malfunction.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation, prolonging battery life and reducing overall power consumption, ideal for portable or battery-powered devices.

No. of I/O Lines: 15

Having 15 I/O lines provides ample connectivity options and signal routing capabilities, enabling seamless integration with other components and peripherals in the system.

Technical Specifications

Serial Communication Controllers SC26C92C1A attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V SUPPLY

Address Bus Width:

4

Boundary Scan:

NO

Maximum Clock Frequency:

8 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.5862 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

15

No. of Serial I/Os:

2

No. of Terminals:

44

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.5862 mm

Trade Compliance

SC26C92C1A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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