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UJA1164TK

NXP Semiconductors

UJA1164TK by NXP Semiconductors

UJA1164TK by NXP Semiconductors is a compact interface IC designed for automotive applications, featuring a max supply voltage of 28V and AEC-Q100 screening. Its small outline package (3mm x 4.5mm) ensures efficient space utilization. Ideal for reliable communication in vehicle networks.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Flip Electronics

USA . 12,000 parts In-Stock

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Digiode

USA . 3,450 parts In-Stock

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3,450

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Anansix

USA . 2,835 parts In-Stock

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Vyrian

USA . 1,816 parts In-Stock

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1,816

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One Stop Electronics

USA . 703 parts In-Stock

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$19.500

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703

$19.500

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UNI Independent Distributors

Spain . 6,740 parts In-Stock

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6,740

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Futuretech Components

Singapore . 6,000 parts In-Stock

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Corphita

USA . 2,289 parts In-Stock

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Perfect Parts

USA . 728 parts In-Stock

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728

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Overview

Unlock unparalleled performance with the UJA1164TK from NXP Semiconductors, a leader in innovative technology. This compact interface IC is engineered for reliability and efficiency, making it ideal for automotive applications and beyond. With AEC-Q100 certification, experience peace of mind knowing you’re backed by top-tier quality. Enhance your designs with this versatile solution that seamlessly integrates into various systems, maximizing functionality while minimizing space.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space and simplifies the assembly process, enhancing manufacturing productivity.

Maximum Supply Voltage: 28 V

A maximum supply voltage of 28 V enables flexibility for use in a wide range of applications, accommodating more robust designs.

Screening Level: AEC-Q100

The AEC-Q100 qualification ensures that this product meets automotive standards, making it a reliable choice for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape maximizes space efficiency on the PCB, allowing for compact designs.

No. of Terminals: 14

Having 14 terminals provides sufficient connection options for integrating various functionalities while maintaining a small footprint.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The slim profile and heat sink ability enhance thermal management, making this product ideal for compact and high-power applications.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V supports low-power applications, offering versatility in designs that require lower operational voltages.

Terminal Position: DUAL

Dual terminal positioning allows for ease of routing and improved layout options on the PCB, facilitating design versatility.

Maximum Seated Height: 1 mm

The low seated height is ideal for space-constrained applications, promoting streamlined designs without compromising performance.

Width: 3 mm

The compact width is perfect for applications where board space is limited, allowing for denser circuit layouts.

Length: 4.5 mm

The short length creates opportunities for tighter spacing in circuit designs, enabling efficient use of PCB real estate.

Terminal Form: NO LEAD

No lead construction minimizes space and enhances electrical performance by reducing parasitic inductance and capacitance.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V makes it suitable for a wide range of applications, providing a good balance of performance and efficiency.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is ideal for high-density designs, allowing for closer placement of components on the PCB.

Interface IC Type: INTERFACE CIRCUIT

Being classified as an interface circuit enables it to facilitate communication between different electronic components, enhancing system integration.

Technical Specifications

Other Function Interface ICs UJA1164TK attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N14

Length:

4.5 mm

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

UJA1164TK Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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