Loading...

UJA1168TK/VX

NXP Semiconductors

UJA1168TK/VX by NXP Semiconductors

UJA1168TK/VX by NXP Semiconductors is a versatile interface IC designed for automotive applications, featuring a max supply voltage of 28V and AEC-Q100 screening. Its compact 14-terminal design ensures efficient space utilization. Ideal for reliable communication in vehicle systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 17,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,960

-

-

-

-

Vyrian

USA . 2,131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,131

-

-

-

-

Anansix

USA . 1,912 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,912

-

-

-

-

Digiode

USA . 605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

605

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 745 parts In-Stock

1+ parts

$38.500

100+ parts

-

1k+ parts

-

10k+ parts

-

745

$38.500

-

-

-

UNI Independent Distributors

Spain . 4,224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,224

-

-

-

-

Corphita

USA . 1,364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,364

-

-

-

-

Perfect Parts

USA . 132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

132

-

-

-

-

Overview

Unlock unparalleled performance with the UJA1168TK/VX by NXP Semiconductors, a trusted leader in innovative electronics. This surface-mount interface IC boasts exceptional quality and reliability, designed to thrive in demanding automotive environments. Its compact dimensions and robust design facilitate seamless integration across various applications, from advanced driver assistance systems to efficient power management, delivering consistent value and efficiency that enhances your projects. Experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making the component reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly, making it suitable for space-constrained applications.

Maximum Supply Voltage: 28 V

With a maximum supply voltage of 28 V, this IC can accommodate a wide range of applications without risk of damage, enhancing design flexibility.

Screening Level: AEC-Q100

Meeting AEC-Q100 standards indicates that the IC is designed for automotive applications, ensuring high reliability and performance under harsh conditions.

Package Shape: RECTANGULAR

The rectangular package shape can facilitate efficient layout and component placement on the PCB, aiding in optimal design.

No. of Terminals: 14

Having 14 terminals allows for a comprehensive set of functionalities, making this IC versatile and capable of complex operations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile design enable integration into compact devices and improve thermal management, essential for high-performance applications.

Minimum Supply Voltage: 3 V

A low minimum supply voltage of 3 V makes this IC suitable for low-power applications, contributing to energy efficiency.

Terminal Position: DUAL

Dual terminal positions allow for improved routing and connectivity options on the PCB, facilitating easier integration.

Maximum Seated Height: 1 mm

A maximum seated height of just 1 mm ensures a very low profile that is ideal for modern ultra-compact electronic designs.

Width: 3 mm

The compact width of 3 mm provides flexibility in design layout, supporting dense configurations within limited board space.

Length: 4.5 mm

The length of 4.5 mm further contributes to the small footprint, making it ideal for miniaturized applications.

Terminal Form: NO LEAD

No lead design improves thermal performance and reduces space requirements while simplifying the manufacturing process.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V strikes a balance between performance and power consumption, making it efficient for various applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for fine-pitch applications, supporting high-density arrangements in modern PCBs.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this IC enables effective communication between different components, ensuring robust system integration.

Technical Specifications

Other Function Interface ICs UJA1168TK/VX attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N14

Length:

4.5 mm

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

UJA1168TK/VX Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20