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UJA1168TK

NXP Semiconductors

UJA1168TK by NXP Semiconductors

UJA1168TK by NXP Semiconductors is a compact interface IC designed for automotive applications, supporting a supply voltage range of 3-28 V. It features a dual terminal position and AEC-Q100 screening level for reliability. Its small outline package ensures efficient space utilization in designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Flip Electronics

USA . 6,250 parts In-Stock

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6,250

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Anansix

USA . 2,899 parts In-Stock

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2,899

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Vyrian

USA . 2,506 parts In-Stock

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2,506

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Digiode

USA . 1,874 parts In-Stock

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1,874

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Distributors (Availability)

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One Stop Electronics

USA . 624 parts In-Stock

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$8.500

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624

$8.500

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 2,849 parts In-Stock

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UNI Independent Distributors

Spain . 2,637 parts In-Stock

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2,637

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Perfect Parts

USA . 132 parts In-Stock

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Overview

Unlock superior performance with the UJA1168TK from NXP Semiconductors, a leader in innovative solutions. This compact interface IC is designed for automotive and industrial applications, ensuring reliability and quality with AEC-Q100 certification. Experience seamless integration with its versatile features, enhancing system efficiency while saving space. Elevate your projects with the UJA1168TK – where cutting-edge technology meets exceptional value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides effective protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact PCB designs and easier automated assembly, contributing to lower production costs and improved efficiency.

Maximum Supply Voltage: 28 V

A high maximum supply voltage enables the IC to accommodate a wider range of applications, increasing its versatility in different electronic systems.

Screening Level: AEC-Q100

AEC-Q100 certification indicates that the product meets strict automotive quality standards, making it reliable for automotive and high-reliability applications.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and allows for optimal placement on PCBs, which is crucial for high-density designs.

No. of Terminals: 14

With 14 terminals, the IC provides multiple connection options, facilitating versatile configurations and enhancing design flexibility.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile contribute to minimizing space on the PCB while the heat sink slug aids in thermal management, ensuring reliable operation in compact designs.

Minimum Supply Voltage: 3 V

Supporting a low minimum supply voltage allows for operation in low-power applications, making this IC suitable for battery-operated devices.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility and ease of routing on the PCB, simplifying the design process.

Maximum Seated Height: 1 mm

A low seated height ensures that the component can fit into slim profiles, making the IC suitable for compact devices and applications.

Width: 3 mm

A narrow width makes it ideal for space-constrained applications, allowing for denser designs without sacrificing performance.

Length: 4.5 mm

This length strikes a balance between area efficiency and functionality, making it easy to incorporate into various designs.

Terminal Form: NO LEAD

No lead design minimizes the footprint and simplifies assembly, while also enhancing performance by reducing inductance and capacitance.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V optimizes performance for standard operating conditions, ensuring reliability in typical applications.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for compact layouts while still enabling efficient soldering processes during assembly.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically as an interface IC, it effectively manages communication between different components, enhancing system connectivity and performance.

Technical Specifications

Other Function Interface ICs UJA1168TK attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N14

Length:

4.5 mm

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

UJA1168TK Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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