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UJA1169TK/FZ

NXP Semiconductors

UJA1169TK/FZ by NXP Semiconductors

UJA1169TK/FZ by NXP Semiconductors is a small outline, heat sink interface IC with 20 terminals. It operates b/w 2.8V to 28V and meets AEC-Q100 standards for automotive applications. With a terminal pitch of 0.5mm, it is ideal for use in automotive electronic systems requiring reliable performance in harsh environments.

Median Price

$1.716

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

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$1.813

10k+ parts

$1.700

36,000

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-

$1.813

$1.700

Rochester

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

$1.620

1k+ parts

$1.450

10k+ parts

$1.360

36,000

-

$1.620

$1.450

$1.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.150

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300

$1.150

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Vyrian

USA . 6,200 parts In-Stock

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6,200

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Anansix

USA . 1,171 parts In-Stock

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1,171

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Digiode

USA . 918 parts In-Stock

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918

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,967 parts In-Stock

1+ parts

$1.150

100+ parts

-

1k+ parts

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10k+ parts

$1.127

5,967

$1.150

-

-

$1.127

Argo Parts USA

USA . 4,261 parts In-Stock

1+ parts

$1.150

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4,261

$1.150

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Netroflash

USA . 500 parts In-Stock

1+ parts

$1.150

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500

$1.150

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One Stop Electronics

USA . 1,415 parts In-Stock

1+ parts

$11.500

100+ parts

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1,415

$11.500

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Microchip USA

USA . 175 parts In-Stock

1+ parts

$15.789

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175

$15.789

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AZTECH Wire

Italy . 725 parts In-Stock

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$16.806

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725

$16.806

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Ampacity Inc.

Singapore . 313 parts In-Stock

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$49.500

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313

$49.500

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Lixinc

USA . 13,243 parts In-Stock

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13,243

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Futuretech Components

Singapore . 9,000 parts In-Stock

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9,000

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UNI Independent Distributors

Spain . 6,746 parts In-Stock

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6,746

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,741 parts In-Stock

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2,741

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Overview

Unlock the potential of your automotive electronics with the UJA1169TK/FZ by NXP Semiconductors. This high-quality interface IC offers unparalleled reliability and performance, thanks to NXP's proven track record as a leading manufacturer in the industry. Ideal for a wide range of applications, this product provides seamless communication between different systems, ensuring optimal functionality and efficiency. Experience the value and benefits of NXP's cutting-edge technology with the UJA1169TK/FZ - the perfect solution for all your interface circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 28 V

Can handle higher voltage levels, making it suitable for a wide range of applications.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, ensuring quality in automotive applications.

No. of Terminals: 20

Provides multiple connection points for interfacing with other components, enhancing flexibility in design.

Maximum Seated Height: 1 mm

Low profile design allows for space-saving in compact electronic devices.

Width: 3.5 mm

Small form factor facilitates integration in tight spaces and reduces overall board size.

Peak Reflow Temperature °C: 260

Can withstand high temperature soldering processes, ensuring reliable solder joints during assembly.

Nominal Supply Voltage: 13 V

Optimal operating voltage for various applications, balancing power consumption and performance.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface functions, providing efficient and reliable communication between different components.

Technical Specifications

Other Function Interface ICs UJA1169TK/FZ attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N20

JESD-609 Code:

e4

Length:

5.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

2.8 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

UJA1169TK/FZ Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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