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TEA6101TD

NXP Semiconductors

TEA6101TD by NXP Semiconductors

TEA6101TD by NXP Semiconductors is a compact consumer IC designed for surface mount applications. It features a 20-terminal gull-wing design, operates at a peak reflow temp of 250 °C, and has a max height of 2.65mm. Ideal for audio processing in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,606 parts In-Stock

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1,606

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Digiode

USA . 1,509 parts In-Stock

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1,509

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Anansix

USA . 1,442 parts In-Stock

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1,442

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,576 parts In-Stock

1+ parts

$6.800

100+ parts

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1,576

$6.800

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UNI Independent Distributors

Spain . 7,982 parts In-Stock

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7,982

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Corphita

USA . 1,257 parts In-Stock

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1,257

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Overview

Unlock the potential of your audio applications with the TEA6101TD from NXP Semiconductors! Renowned for their innovation and quality, NXP delivers exceptional performance in a compact design. This versatile IC enhances sound clarity and efficiency, making it ideal for consumer electronics, audio systems, and more. Experience unmatched reliability and seamless integration, ensuring your projects excel with superior audio fidelity. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental conditions, making this product reliable for various consumer applications.

Surface Mount: YES

Being a surface mount device allows for easy integration into modern circuit boards, facilitating compact design and efficient manufacturing processes.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on the PCB, allowing for higher density layouts and improving overall design flexibility.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, it is tailored for a wide range of applications in consumer electronics, ensuring compatibility and effectiveness in everyday devices.

No. of Terminals: 20

With 20 terminals, this IC offers sufficient connectivity options for a variety of functions, supporting complex designs and features in consumer products.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact design, ideal for space-constrained applications in modern electronics.

Terminal Position: DUAL

Dual terminal positioning enhances signal integrity and simplifies layout for differential signaling applications, improving performance in high-speed designs.

Maximum Seated Height: 2.65 mm

A low maximum seated height allows for a slim profile, which is advantageous in devices where thickness is a critical factor, thus enhancing design options.

Width: 7.5 mm

At 7.5 mm wide, this IC strikes a balance between compactness and ease of handling during assembly, making it practical for various applications.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum peak reflow time of 40 seconds ensures compatibility with high-speed production processes while minimizing the risk of thermal damage to the IC.

Peak Reflow Temperature °C: 250

Reaching a peak reflow temperature of 250 °C makes this IC suitable for robust manufacturing setups, ensuring reliable soldering and connectivity.

Length: 12.8 mm

The 12.8 mm length is indicative of a compact design, allowing for versatile placement options on a PCB without compromising functionality or accessibility.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and improves mechanical strength, contributing to a robust connection with the circuit board.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a good balance between spacing for soldering ease and compact layout, enhancing the overall design flexibility in consumer applications.

Technical Specifications

Other Function Consumer ICs TEA6101TD attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

TEA6101TD General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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