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TEA6420D

STMicroelectronics

TEA6420D by STMicroelectronics

TEA6420D by STMicroelectronics is a 28-terminal IC with operating temp range of 0-70 °C. It has a supply voltage range of 8-10.2V and max current of 8mA, suitable for consumer circuit applications. The package style is small outline, making it compact at dimensions of 17.9x7.5x2.65mm for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,652 parts In-Stock

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4,652

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Bristol Electronics

USA . 4,000 parts In-Stock

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4,000

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Anansix

USA . 1,887 parts In-Stock

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1,887

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Vyrian

USA . 1,086 parts In-Stock

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1,086

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LIBRA Elektronik GmbH

Germany . 476 parts In-Stock

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476

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ComSIT Distribution GmbH

Germany . 112 parts In-Stock

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Prism Electronics

USA . 12 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,975 parts In-Stock

1+ parts

$0.527

100+ parts

-

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$0.474

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1,975

$0.527

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$0.474

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MKK Technologies

India . 2,297 parts In-Stock

1+ parts

$0.991

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2,297

$0.991

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DigiPath Technology Company

USA . 2,297 parts In-Stock

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$0.991

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2,297

$0.991

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A-Z Elektronik GmbH

Germany . 5,579 parts In-Stock

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Kepictronics

USA . 5,390 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Corphita

USA . 2,450 parts In-Stock

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Perfect Parts

USA . 280 parts In-Stock

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280

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Futuretech Components

Singapore . 243 parts In-Stock

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Parana Technologies

USA . 76 parts In-Stock

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$0.630

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76

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$0.630

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Assy Fe

Spain . 1 parts In-Stock

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Overview

Unleash the power of audio with the TEA6420D by STMicroelectronics. Crafted with precision and expertise, this innovative consumer IC offers unparalleled performance for a wide range of applications. With its high-quality construction and advanced features, this product delivers exceptional value and reliability to customers. Experience superior sound quality and seamless integration with the TEA6420D, setting new standards in consumer circuit technology. Elevate your audio experience and explore endless possibilities with this cutting-edge solution from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material provides good durability and protection for the IC, making it suitable for consumer applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and provides a compact form factor for efficient PCB design and space utilization.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70 °C, this IC can withstand various environmental conditions and operate reliably under heat.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures good conductivity and corrosion resistance, enhancing the overall reliability and longevity of the IC.

Width: 7.5 mm

Narrow width of 7.5 mm allows for compact integration into electronic devices, saving space and enabling sleek design aesthetics.

Minimum Supply Voltage (Vsup): 8 V

Requires a low minimum supply voltage of 8 V, making it suitable for a wide range of consumer electronic applications and energy-efficient designs.

Temperature Grade: COMMERCIAL

Commercial grade temperature rating ensures reliable performance in typical operating conditions, meeting the needs of most consumer electronics.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, allowing for safe storage and handling practices to prevent damage during manufacturing and operation.

Maximum Supply Voltage (Vsup): 10.2 V

Can handle a maximum supply voltage of 10.2 V, providing a suitable operating range for various consumer applications without risking overvoltage damage.

Technical Specifications

Other Function Consumer ICs TEA6420D attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

8 mA

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TEA6420D General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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