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TEA6101P

NXP Semiconductors

TEA6101P by NXP Semiconductors

TEA6101P by NXP Semiconductors is a consumer circuit IC with 18 terminals in a rectangular plastic/epoxy package. It features a max height of 4.7 mm, dual terminal position, and through-hole form. Ideal for audio applications, it ensures reliable performance in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,559 parts In-Stock

1+ parts

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1k+ parts

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3,559

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Vyrian

USA . 2,493 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,493

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Anansix

USA . 2,113 parts In-Stock

1+ parts

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100+ parts

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2,113

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 993 parts In-Stock

1+ parts

$2.800

100+ parts

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1k+ parts

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10k+ parts

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993

$2.800

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UNI Independent Distributors

Spain . 7,933 parts In-Stock

1+ parts

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100+ parts

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7,933

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Corphita

USA . 3,824 parts In-Stock

1+ parts

-

100+ parts

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3,824

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Overview

Elevate your audio experience with the TEA6101P from NXP Semiconductors, renowned for their cutting-edge technology and reliability. This versatile consumer IC offers exceptional sound quality and performance, making it ideal for a range of applications from home audio systems to portable devices. With its robust design and trusted manufacturer backing, the TEA6101P ensures longevity and superior functionality, delivering unparalleled value that keeps your projects ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent durability and protection against environmental factors, making this product reliable for various consumer applications.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization on PCB layouts, allowing for peak performance in compact designs.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, it's designed specifically for consumer electronics applications, ensuring optimal functionality and user experience.

No. of Terminals: 18

Having 18 terminals allows for versatile connectivity options, making it suitable for complex circuit designs.

Package Style (Meter): IN-LINE

The in-line package style simplifies placement and assembly on PCB, resulting in improved manufacturing efficiency and reliability.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and provides long-term resistance against corrosion, ensuring a stable connection over time.

Terminal Position: DUAL

Dual terminal positioning optimizes design flexibility and facilitates easier integration into various device architectures.

Maximum Seated Height: 4.7 mm

The compact seated height allows for low-profile designs, making it ideal for space-constrained applications without compromising on performance.

Width: 7.62 mm

This width provides a balance of adequate space for connections while also fitting into a variety of standard electronic designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical support, making the product easier to handle during assembly and increasing its reliability in final applications.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is a common standard, ensuring compatibility with various PCB designs and ease of assembly.

Technical Specifications

Other Function Consumer ICs TEA6101P attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e3/e4

No. of Terminals:

18

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Surface Mount:

NO

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TEA6101P General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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