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TEA6101TD-T

NXP Semiconductors

TEA6101TD-T by NXP Semiconductors

TEA6101TD-T from NXP Semiconductors is a compact consumer IC designed for surface mount applications. It features 20 terminals, a max height of 2.65 mm, and a rectangular shape, making it ideal for space-constrained electronic devices. This versatile chip excels in audio processing and signal amplification tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,077 parts In-Stock

1+ parts

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2,077

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Vyrian

USA . 1,749 parts In-Stock

1+ parts

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1k+ parts

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1,749

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Digiode

USA . 1,429 parts In-Stock

1+ parts

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1,429

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 759 parts In-Stock

1+ parts

$17.800

100+ parts

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759

$17.800

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UNI Independent Distributors

Spain . 4,570 parts In-Stock

1+ parts

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4,570

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Corphita

USA . 2,749 parts In-Stock

1+ parts

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2,749

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Overview

Elevate your audio experience with the TEA6101TD-T from NXP Semiconductors, a leader in high-quality consumer ICs. Designed for seamless integration, this compact, surface-mount chip enhances sound clarity and performance in various applications—from home audio systems to portable devices. With NXP's commitment to reliability and innovation, you gain not just superior technology, but also peace of mind and unmatched value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability, making this product suitable for various consumer electronic applications.

Surface Mount: YES

Being a surface mount device allows for efficient space utilization on PCBs, enabling compact and modern electronics design.

Package Shape: RECTANGULAR

The rectangular shape of the package provides optimal layout flexibility on circuit boards and facilitates easier integration with other components.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, it is tailored for use in everyday electronic appliances, ensuring compatibility with a wide range of consumer applications.

No. of Terminals: 20

With 20 terminals, this IC offers a good balance between complexity and size, making it versatile for various functionalities in consumer devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for modern compact electronics, enabling high-density PCB designs while retaining performance.

Terminal Position: DUAL

Dual terminal positioning contributes to improved electrical performance and makes PCB design more flexible, enhancing usability.

Maximum Seated Height: 2.65 mm

The low seated height keeps the components close to the PCB, lowering the overall profile of the device and fitting into slimmer product designs.

Width: 7.5 mm

This width is optimal for efficient board layout, providing space for additional components while maintaining performance integrity.

Length: 12.8 mm

The length of 12.8 mm strikes a balance between functionality and compactness, allowing it to fit into a variety of consumer signal paths.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics for surface-mount applications, ensuring strong mechanical and electrical connections.

Terminal Pitch: 1.27 mm

The 1.27 mm pitch makes it easy to integrate in high-density applications while facilitating reliable connections without sacrificing performance.

Technical Specifications

Other Function Consumer ICs TEA6101TD-T attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TEA6101TD-T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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