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TEA6101PN

NXP Semiconductors

TEA6101PN by NXP Semiconductors

TEA6101PN from NXP Semiconductors is a versatile consumer IC with 18 terminals and a rectangular plastic/epoxy package. It features a max height of 4.7 mm, dual terminal position, and through-hole form. Ideal for audio applications, it ensures reliable performance in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,287 parts In-Stock

1+ parts

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3,287

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Digiode

USA . 2,524 parts In-Stock

1+ parts

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1k+ parts

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2,524

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Anansix

USA . 754 parts In-Stock

1+ parts

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754

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 329 parts In-Stock

1+ parts

$20.800

100+ parts

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1k+ parts

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10k+ parts

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329

$20.800

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UNI Independent Distributors

Spain . 6,815 parts In-Stock

1+ parts

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6,815

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Corphita

USA . 143 parts In-Stock

1+ parts

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143

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Overview

Elevate your audio experience with the TEA6101PN, expertly crafted by NXP Semiconductors—an industry leader renowned for innovation and reliability. This versatile consumer IC enhances sound quality while offering seamless integration in various applications, from home theater systems to portable devices. With its robust build and dual terminal design, the TEA6101PN ensures exceptional performance and durability, providing customers unmatched value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the package durable and resistant to environmental stress, ensuring long-term reliability.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, making it easier to integrate into various designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC offers tailored performance suitable for everyday electronic devices.

No. of Terminals: 18

With 18 terminals, this product provides adequate connectivity options to support complex functionalities in consumer electronics.

Package Style (Meter): IN-LINE

The in-line package style simplifies the assembly process and can enhance signal integrity in application circuits.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

This terminal finish promotes excellent solderability and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for flexible installation configurations, accommodating various design requirements in consumer products.

Maximum Seated Height: 4.7 mm

A maximum seated height of 4.7 mm allows for low-profile designs, making it suitable for compact electronic devices.

Width: 7.62 mm

The width of 7.62 mm is standard, facilitating compatibility with existing PCB designs and components.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support and simplifies soldering in various assembly environments.

Terminal Pitch: 2.54 mm

A pitch of 2.54 mm is a widely accepted standard that enhances compatibility with various circuit boards and simplifies manufacturing.

Technical Specifications

Other Function Consumer ICs TEA6101PN attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e3/e4

No. of Terminals:

18

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Surface Mount:

NO

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TEA6101PN General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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