Loading...

TEA6101T-T

NXP Semiconductors

TEA6101T-T by NXP Semiconductors

TEA6101T-T by NXP Semiconductors is a compact consumer IC designed for surface mount applications. It features a 20-terminal gull-wing design, with dimensions of 12.8 mm x 7.5 mm and a max height of 2.65 mm, ideal for space-constrained devices. This versatile chip excels in audio processing and signal amplification tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,826 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,826

-

-

-

-

Vyrian

USA . 3,979 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,979

-

-

-

-

Anansix

USA . 2,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,636

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,336 parts In-Stock

1+ parts

$18.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,336

$18.800

-

-

-

Corphita

USA . 3,616 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,616

-

-

-

-

UNI Independent Distributors

Spain . 1,504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,504

-

-

-

-

Overview

Unlock superior performance with the TEA6101T-T from NXP Semiconductors, a leader in innovative solutions. This compact consumer IC delivers reliable quality for a variety of applications, ensuring seamless integration into your designs. Enjoy enhanced efficiency and longevity while reducing overall system complexity. Trust NXP’s legacy of excellence, providing you with peace of mind and exceptional value, perfect for elevating your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental conditions, making the IC suitable for various consumer applications.

Surface Mount: YES

Surface mount capability allows for compact designs and high-density circuit layouts, making it ideal for modern electronic devices.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space utilization on PCB layouts, crucial for space-constrained consumer electronics.

General IC Type: CONSUMER CIRCUIT

Being a consumer circuit IC, it ensures compatibility with a wide range of consumer applications, enhancing market versatility.

No. of Terminals: 20

20 terminals provide ample connectivity options for diverse functionalities, enhancing the adaptability of the IC in various applications.

Package Style (Meter): SMALL OUTLINE

The small outline design is suitable for space-efficient applications, making it a perfect choice for modern, compact devices.

Terminal Position: DUAL

Dual terminal positioning facilitates better alignment and soldering on PCBs, improving manufacturing efficiency.

Maximum Seated Height: 2.65 mm

A low seated height contributes to a thinner overall profile in electronic designs, which is essential for contemporary sleek product designs.

Width: 7.5 mm

The width of 7.5 mm strikes a balance between performance and space, making this IC a flexible choice for various compact systems.

Length: 12.8 mm

The length of 12.8 mm provides a compact form factor, ideal for fitting into small consumer products without compromising performance.

Terminal Form: GULL WING

Gull wing terminals enhance soldering capabilities and provide reliable connections, ensuring durability and performance in consumer electronics.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for fine spacing between terminals, supporting high-density applications while maintaining soldering accuracy.

Technical Specifications

Other Function Consumer ICs TEA6101T-T attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TEA6101T-T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19