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TDA19978AHV15C185,

NXP Semiconductors

TDA19978AHV15C185, by NXP Semiconductors

The TDA19978AHV15C185 from NXP Semiconductors is a consumer IC designed for flatpack surface mount applications. It operates at 1.8V and 3.3V with a max temp of 70 °C, featuring 144 gull-wing terminals in a quad position. Ideal for various consumer electronics, it utilizes CMOS technology for efficient performance.

Median Price

$5.940

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 454 parts In-Stock

1+ parts

-

100+ parts

$5.280

1k+ parts

$4.730

10k+ parts

$4.450

454

-

$5.280

$4.730

$4.450

Verical

USA . 454 parts In-Stock

1+ parts

-

100+ parts

$6.600

1k+ parts

$5.912

10k+ parts

$5.563

454

-

$6.600

$5.912

$5.563

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,003 parts In-Stock

1+ parts

$5.596

100+ parts

-

1k+ parts

-

10k+ parts

-

4,003

$5.596

-

-

-

Vyrian

USA . 5,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,330

-

-

-

-

Anansix

USA . 1,701 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,701

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,710 parts In-Stock

1+ parts

$5.301

100+ parts

-

1k+ parts

-

10k+ parts

-

3,710

$5.301

-

-

-

AZTECH Wire

Italy . 1,161 parts In-Stock

1+ parts

$9.510

100+ parts

-

1k+ parts

-

10k+ parts

-

1,161

$9.510

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 17,467 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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17,467

-

-

-

-

UNI Independent Distributors

Spain . 5,546 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,546

-

-

-

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Microchip USA

USA . 5,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,490

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Overview

Elevate your consumer electronics with the TDA19978AHV15C185 from NXP Semiconductors, a powerhouse in quality and innovation. Designed for seamless integration, this versatile IC offers unparalleled reliability and efficiency, ensuring your devices perform at their best. With its compact design and robust thermal performance, it's perfect for a wide range of applications—from home entertainment to automotive solutions—delivering exceptional value that keeps you ahead in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making this IC suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern electronic devices, optimizing space and performance.

Package Shape: SQUARE

The square shape of the package facilitates efficient use of PCB space, allowing for more components in a smaller area.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics, ensuring the IC meets the performance needs of common applications in this sector.

Power Supplies: 1.8V, 3.3V

Dual supply voltage options provide flexibility in design, accommodating a wide range of consumer electronic products.

No. of Terminals: 144

A high number of terminals allows for comprehensive connectivity and increased functionality within a compact design.

Package Style: FLATPACK

The flatpack style enables efficient handling and assembly, making it ideal for automation in manufacturing processes.

Maximum Operating Temperature: 70 °C

Operates effectively up to 70 °C, ensuring reliability in various environments typical for consumer applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this IC is suitable for a range of user environments, including slightly colder settings.

Terminal Position: QUAD

Quad terminal positioning facilitates easier soldering and connection on PCBs, contributing to enhanced manufacturing efficiency.

Temperature Grade: COMMERCIAL

As a commercial-grade component, it ensures appropriate performance standards for everyday consumer products.

Technology: CMOS

CMOS technology allows for low power consumption and high speed, making the IC a powerful choice for battery-operated consumer devices.

Terminal Form: GULL WING

Gull wing terminal design enhances solder joint reliability, reducing the risk of mechanical failures in consumer electronics.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density packing of components on PCBs, essential for modern, compact electronic designs.

Technical Specifications

Other Function Consumer ICs TDA19978AHV15C185, attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA19978AHV15C185, General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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