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TDA19978AHV/15/C18

NXP Semiconductors

TDA19978AHV/15/C18 by NXP Semiconductors

TDA19978AHV/15/C18 by NXP Semiconductors is a consumer IC designed for flatpack surface mount applications. It operates at 1.8V and 3.3V with a max temp of 70 °C, featuring 144 terminals in a quad configuration. Ideal for various consumer electronics, it utilizes CMOS technology for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,376 parts In-Stock

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Digiode

USA . 2,070 parts In-Stock

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2,070

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Anansix

USA . 1,352 parts In-Stock

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One Stop Electronics

USA . 410 parts In-Stock

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$5.800

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410

$5.800

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AZTECH Wire

Italy . 144 parts In-Stock

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$15.800

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144

$15.800

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QUARKTWIN TECHNOLOGY LTD

USA . 3,730 parts In-Stock

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3,730

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Microchip USA

USA . 3,569 parts In-Stock

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UNI Independent Distributors

Spain . 906 parts In-Stock

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906

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Corphita

USA . 426 parts In-Stock

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Overview

Elevate your consumer electronics with the TDA19978AHV/15/C18 from NXP Semiconductors, a trusted leader in innovation and quality. Designed for versatility, this advanced IC enhances audio and video applications, ensuring pristine performance in diverse environments. Its robust design and efficient power management lead to superior reliability, making it an ideal choice for developers seeking exceptional value and unparalleled benefits in their next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability in various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of board space and simplifies assembly processes.

Package Shape: SQUARE

The square package shape provides a compact design, making it suitable for space-constrained applications.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC meets the typical requirements and expectations of consumer electronics.

Power Supplies (V): 1.8, 3.3

Support for multiple voltage levels (1.8V and 3.3V) enables flexible integration into various systems.

No. of Terminals: 144

A high number of terminals (144) allows for extensive circuitry options and increased functionality.

Package Style (Meter): FLATPACK

The flatpack style offers a low profile that is ideal for modern electronic designs.

Maximum Operating Temperature: 70 °C

The maximum temperature rating of 70 °C ensures reliable operation in warm environments.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this IC is suitable for a wide range of environmental conditions.

Terminal Position: QUAD

Quad terminal positioning aids in effective heat dissipation and improves performance in dense applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade makes the product ideal for general consumer electronics applications.

Technology: CMOS

CMOS technology provides low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form facilitates easier soldering and improves overall reliability.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for higher density circuit designs, making this IC highly versatile.

Technical Specifications

Other Function Consumer ICs TDA19978AHV/15/C18 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA19978AHV/15/C18 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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