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TDA18274HN/C1,518

NXP Semiconductors

TDA18274HN/C1,518 by NXP Semiconductors

TDA18274HN/C1,518 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates at 3.3V with a quad terminal layout and features a moisture sensitivity level of 3. Ideal for compact electronic devices, it ensures efficient performance in various applications.

Median Price

$1.348

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 40,000 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.140

10k+ parts

$1.070

40,000

-

$1.270

$1.140

$1.070

Verical

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.425

10k+ parts

$1.337

36,000

-

-

$1.425

$1.337

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,920 parts In-Stock

1+ parts

$1.349

100+ parts

-

1k+ parts

-

10k+ parts

-

1,920

$1.349

-

-

-

DigiKey Marketplace

USA . 40,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40,000

-

-

-

-

Vyrian

USA . 3,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,624

-

-

-

-

Anansix

USA . 1,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,091

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 294 parts In-Stock

1+ parts

$1.278

100+ parts

-

1k+ parts

-

10k+ parts

-

294

$1.278

-

-

-

Microchip USA

USA . 1,526 parts In-Stock

1+ parts

$2.296

100+ parts

-

1k+ parts

-

10k+ parts

-

1,526

$2.296

-

-

-

AZTECH Wire

Italy . 1,029 parts In-Stock

1+ parts

$20.130

100+ parts

-

1k+ parts

-

10k+ parts

-

1,029

$20.130

-

-

-

UNI Independent Distributors

Spain . 2,065 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,065

-

-

-

-

Overview

Elevate your consumer electronics with the TDA18274HN/C1,518 from NXP Semiconductors—an industry leader in innovation and quality. This versatile IC is designed to enhance performance across a variety of applications, ensuring reliable operation while delivering exceptional audio and video experiences. With its compact design and robust features, you gain superior efficiency and ease of integration, making it the perfect choice for modern devices. Trust in NXP’s commitment to excellence to unlock new possibilities for your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount technology allows for more compact circuit designs and easier assembly, making the product suitable for modern electronic devices.

Package Shape: SQUARE

A square package shape optimizes space on PCBs and allows for efficient heat dissipation, enhancing performance.

Power Supplies (V): 3.3

Operating at 3.3V is ideal for low-power applications, ensuring energy efficiency and compatibility with many digital circuits.

No. of Terminals: 40

With 40 terminals, this product offers versatile connectivity options, allowing for complex functionalities in a compact footprint.

Package Style (Meter): CHIP CARRIER

The chip carrier style helps in minimizing parasitic inductance and capacitance, leading to improved signal integrity.

Terminal Position: QUAD

Quad terminal positioning allows for efficient use of space and enhances the product's integration in multi-layered PCB designs.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates the product's resilience in high-temperature soldering processes, ensuring reliability in assembly.

Terminal Form: NO LEAD

With a no-lead form factor, this product reduces the size and weight, making it perfect for compact and portable devices.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density packing of components, maximizing the available space on a circuit board.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, making this product suitable for environments requiring reasonable handling precautions.

Technical Specifications

Other Function Consumer ICs TDA18274HN/C1,518 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18274HN/C1,518 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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