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TDA18254AHN/C1S1,5

NXP Semiconductors

TDA18254AHN/C1S1,5 by NXP Semiconductors

TDA18254AHN/C1S1,5 by NXP Semiconductors is a compact consumer IC with a 48-terminal chip carrier design. It operates at 3.3V, supports max current of 295mA, and functions effectively in temps from 0 °C to 70 °C. Ideal for surface mount applications in commercial electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,338 parts In-Stock

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4,338

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Anansix

USA . 2,329 parts In-Stock

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2,329

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Digiode

USA . 1,496 parts In-Stock

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1,496

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Distributors (Availability)

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Microchip USA

USA . 484 parts In-Stock

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$1.000

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484

$1.000

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AZTECH Wire

Italy . 351 parts In-Stock

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$9.750

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351

$9.750

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One Stop Electronics

USA . 1,223 parts In-Stock

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$15.800

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$15.800

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UNI Independent Distributors

Spain . 8,355 parts In-Stock

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Corphita

USA . 4,276 parts In-Stock

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Overview

Unlock the full potential of your consumer electronics with the TDA18254AHN/C1S1,5 from NXP Semiconductors. Designed for superior performance and reliability, this IC seamlessly enhances audio and video applications, providing crystal-clear quality that impresses users. With NXP's renowned innovation backing it, you can trust in its durability and efficient power management. Elevate your products and deliver unmatched experiences with a solution engineered for excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and insulation, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for compact designs and is ideal for high-density assembly, enhancing the product's versatility.

Package Shape: SQUARE

The square package shape optimizes space on the PCB layout, facilitating better integration into device designs.

Power Supplies: 3.3 V

Operating at 3.3 V makes this IC compatible with many low-power digital systems, improving efficiency and reducing power consumption.

No. of Terminals: 48

With 48 terminals, the product provides extensive connectivity options, suitable for complex applications requiring multiple interfaces.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging allows for easy handling and mounting on PCBs, promoting efficient manufacturing processes.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability under various environmental conditions, enhancing the product's longevity.

Minimum Operating Temperature: 0 °C

The capability to operate from 0 °C allows for use in environments without extreme cold conditions, broadening application possibilities.

Terminal Position: QUAD

Quad terminal positioning aids in stable connections and simplifies PCB layout design, improving overall assembly efficiency.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C supports high-temperature soldering processes, ensuring compatibility with advanced manufacturing techniques.

Temperature Grade: COMMERCIAL

Classified as commercial grade, this IC is reliable for general consumer applications where high-performance specifications are necessary.

Terminal Form: NO LEAD

No lead design minimizes environmental impact and simplifies handling during the manufacturing process, aligning with modern standards.

Maximum Supply Current: 295 mA

A maximum supply current of 295 mA allows for robust power delivery to the IC, supporting demanding application requirements.

Terminal Pitch: 0.5 mm

A tight terminal pitch of 0.5 mm enables designs to be more compact and allows for an increase in functional density on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, which is manageable for most production environments, ensuring reliability post-manufacturing.

Technical Specifications

Other Function Consumer ICs TDA18254AHN/C1S1,5 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N48

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

295 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18254AHN/C1S1,5 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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