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TDA18253HN/C1,551

NXP Semiconductors

TDA18253HN/C1,551 by NXP Semiconductors

TDA18253HN/C1,551 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates at 3.3V with a compact 48-terminal quad package and withstands peak reflow temps of 260 °C. Ideal for enhancing audio/video systems in consumer electronics.

Median Price

$1.962

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 260 parts In-Stock

1+ parts

$5.740

100+ parts

$3.590

1k+ parts

-

10k+ parts

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260

$5.740

$3.590

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Flip Electronics (Authorized)

USA . 28,000 parts In-Stock

1+ parts

-

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28,000

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Rochester

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$1.760

1k+ parts

$1.570

10k+ parts

$1.480

260

-

$1.760

$1.570

$1.480

Verical

USA . 260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.962

10k+ parts

$1.850

260

-

-

$1.962

$1.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,666 parts In-Stock

1+ parts

$1.862

100+ parts

-

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4,666

$1.862

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Flip Electronics

USA . 28,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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28,000

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Vyrian

USA . 4,827 parts In-Stock

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4,827

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Anansix

USA . 107 parts In-Stock

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107

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,932 parts In-Stock

1+ parts

$1.764

100+ parts

-

1k+ parts

-

10k+ parts

-

3,932

$1.764

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AZTECH Wire

Italy . 607 parts In-Stock

1+ parts

$20.390

100+ parts

-

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607

$20.390

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Microchip USA

USA . 4,512 parts In-Stock

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4,512

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Perfect Parts

USA . 1,747 parts In-Stock

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1,747

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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UNI Independent Distributors

Spain . 283 parts In-Stock

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283

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Authorized Procurement Solutions

USA . 260 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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260

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-

Overview

Elevate your consumer electronics with the TDA18253HN/C1,551 from NXP Semiconductors. This cutting-edge IC is designed to optimize performance and reliability across a range of applications, ensuring crystal-clear audio and video experiences. With NXP's reputation for innovation and quality, this versatile component offers seamless integration and exceptional durability, empowering you to deliver superior products that delight customers and push technological boundaries.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the IC reliable for long-term applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and simplifies automated manufacturing processes.

Package Shape: SQUARE

The square shape facilitates easier placement on PCBs and optimizes the density of component placement.

Power Supplies: 3.3V

Operating at a low voltage of 3.3V enhances power efficiency and reduces heat generation, making it suitable for energy-sensitive applications.

No. of Terminals: 48

With 48 terminals, this IC offers ample connectivity options for complex functions and features in various applications.

Package Style: CHIP CARRIER

The chip carrier style allows for enhanced thermal and electrical performance, beneficial for high-speed and high-frequency applications.

Terminal Position: QUAD

The quad terminal position optimizes space and provides better routing options for PCB design, improving overall layout efficiency.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C ensures compatibility with high-temperature soldering processes, making it suitable for modern manufacturing methods.

Terminal Form: NO LEAD

No lead configuration helps to reduce the overall footprint of the IC, perfect for miniaturized designs.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for denser packaging of components, enabling more capabilities in a smaller space.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates the device has moderate moisture sensitivity, ensuring best practices for handling to prevent damage during manufacturing.

Technical Specifications

Other Function Consumer ICs TDA18253HN/C1,551 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N48

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18253HN/C1,551 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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