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TDA18250HN/C1,551

NXP Semiconductors

TDA18250HN/C1,551 by NXP Semiconductors

TDA18250HN/C1,551 by NXP Semiconductors is a compact consumer IC designed for efficient signal processing. It operates at 3.3V with a 48-terminal quad configuration and supports surface mount technology. Ideal for multimedia applications, it features a peak reflow temp of 260 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,663 parts In-Stock

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6,663

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Digiode

USA . 2,075 parts In-Stock

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2,075

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Anansix

USA . 1,428 parts In-Stock

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1,428

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 104 parts In-Stock

1+ parts

$2.541

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104

$2.541

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One Stop Electronics

USA . 657 parts In-Stock

1+ parts

$7.800

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657

$7.800

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AZTECH Wire

Italy . 337 parts In-Stock

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$10.980

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337

$10.980

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UNI Independent Distributors

Spain . 7,918 parts In-Stock

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7,918

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Corphita

USA . 3,205 parts In-Stock

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3,205

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Overview

Experience unmatched performance and reliability with the TDA18250HN/C1,551 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP empowers your designs with this versatile consumer IC, ideal for a wide range of applications. Its compact, surface-mount design ensures easy integration while delivering superior functionality. Elevate your products with enhanced efficiency and seamless operations—choose NXP for lasting value and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures good durability and reliability, making this product suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact designs, making it easier to integrate into modern circuit boards.

Package Shape: SQUARE

A square package shape provides uniform thermal and electrical performance, which is beneficial for high-density applications.

Power Supplies (V): 3.3

Operating at 3.3V is ideal for low-power applications, facilitating energy efficiency and extending battery life in portable devices.

No. of Terminals: 48

With 48 terminals, this IC offers ample connectivity options for more complex functionalities, enhancing overall system performance.

Package Style (Meter): CHIP CARRIER

The chip carrier style allows for efficient heat dissipation and is suitable for high-performance applications.

Terminal Position: QUAD

The quad terminal position provides versatility in layout options, making it easier to design compact and efficient PCBs.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with standard soldering processes, making it easy to integrate into manufacturing workflows.

Terminal Form: NO LEAD

The no-lead terminal form reduces the footprint of the IC, allowing for more compact designs and easier assembly on PCBs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports high-density interconnection and makes it suitable for modern, compact electronic designs.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product can withstand moderate moisture exposure, making it robust enough for various environmental conditions.

Technical Specifications

Other Function Consumer ICs TDA18250HN/C1,551 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N48

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18250HN/C1,551 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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