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PN5180A0HN/C4E

NXP Semiconductors

PN5180A0HN/C4E by NXP Semiconductors

TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: NICKEL PALLADIUM GOLD; Peak Reflow Temperature (C): 260;

Median Price

$12.220

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 72 parts In-Stock

1+ parts

$9.370

100+ parts

$6.030

1k+ parts

$5.300

10k+ parts

-

72

$9.370

$6.030

$5.300

-

Mouser Electronics

USA . 408 parts In-Stock

1+ parts

$12.220

100+ parts

$7.870

1k+ parts

$6.550

10k+ parts

-

408

$12.220

$7.870

$6.550

-

Newark

USA . 72 parts In-Stock

1+ parts

$12.340

100+ parts

$7.940

1k+ parts

$6.970

10k+ parts

-

72

$12.340

$7.940

$6.970

-

Element14

Singapore . 72 parts In-Stock

1+ parts

$15.970

100+ parts

$11.070

1k+ parts

$9.600

10k+ parts

-

72

$15.970

$11.070

$9.600

-

Verical

USA . 980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.929

10k+ parts

-

980

-

-

$5.929

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$7.020

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$7.020

-

-

-

Digiode

USA . 4,533 parts In-Stock

1+ parts

$8.426

100+ parts

-

1k+ parts

-

10k+ parts

-

4,533

$8.426

-

-

-

Vyrian

USA . 4,921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,921

-

-

-

-

Anansix

USA . 1,335 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,335

-

-

-

-

TME

Poland . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.160

10k+ parts

-

80

-

-

$7.160

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 587 parts In-Stock

1+ parts

$7.210

100+ parts

$5.520

1k+ parts

-

10k+ parts

-

587

$7.210

$5.520

-

-

Ampacity Inc.

Singapore . 201 parts In-Stock

1+ parts

$7.540

100+ parts

-

1k+ parts

-

10k+ parts

-

201

$7.540

-

-

-

Corphita

USA . 3,294 parts In-Stock

1+ parts

$7.983

100+ parts

-

1k+ parts

-

10k+ parts

-

3,294

$7.983

-

-

-

AZTECH Wire

Italy . 693 parts In-Stock

1+ parts

$19.645

100+ parts

-

1k+ parts

-

10k+ parts

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693

$19.645

-

-

-

UNI Independent Distributors

Spain . 4,687 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,687

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$6.880

1k+ parts

$6.669

10k+ parts

$6.529

100

-

$6.880

$6.669

$6.529

Technical Specifications

Other Function Telecom Interface ICs PN5180A0HN/C4E attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PN5180A0HN/C4E Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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