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NX5DV713HF,118

NXP Semiconductors

NX5DV713HF,118 by NXP Semiconductors

NX5DV713HF,118 from NXP Semiconductors is a versatile SPDT multiplexer with 3 functions and operates b/w -40 °C to 85 °C. It features a compact chip carrier package with 32 terminals and supports power supplies of 3.3V and 5V. Ideal for industrial applications requiring reliable switching in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,032 parts In-Stock

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4,032

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Anansix

USA . 2,891 parts In-Stock

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2,891

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Digiode

USA . 294 parts In-Stock

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294

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Distributors (Availability)

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One Stop Electronics

USA . 423 parts In-Stock

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$1.500

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423

$1.500

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QUARKTWIN TECHNOLOGY LTD

USA . 18,048 parts In-Stock

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UNI Independent Distributors

Spain . 7,633 parts In-Stock

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Microchip USA

USA . 6,045 parts In-Stock

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6,045

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Corphita

USA . 2,313 parts In-Stock

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2,313

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Overview

Unlock unparalleled performance with the NX5DV713HF,118 from NXP Semiconductors, a trusted name in innovation. This high-quality multiplexer delivers exceptional reliability in diverse applications, ensuring your designs meet the highest standards. With robust temperature resilience and efficient power management, it’s perfect for industrial uses where precision matters. Experience seamless integration and superior functionality that drive your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for a compact design and easy integration into modern circuit boards, making it ideal for space-constrained applications.

No. of Functions: 3

With three functions, this multiplexer/switch can handle multiple signals, providing versatility in circuit design and reducing the need for additional components.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board space and facilitates efficient layout designs, contributing to improved performance.

Power Supplies (V): 3.3, 5

Supporting common operating voltages of 3.3V and 5V makes this product compatible with a wide range of electronic devices.

No. of Terminals: 32

Having 32 terminals enables numerous connections, enhancing the product's ability to handle complex switching applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style provides efficient heat dissipation and allows for easy manual soldering, beneficial for prototyping and low-volume production.

Maximum Operating Temperature: 85 °C

Designed to operate up to 85 °C, this product is suitable for industrial environments where higher temperatures are common.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this multiplexer/switch is ideal for applications in extreme cold environments.

Terminal Position: QUAD

The quad terminal position supports efficient routing on circuit boards, facilitating easier integration with other components.

Output (V): SEPARATE OUTPUT

Separate output capability allows for better signal integrity and flexibility in circuit design, enhancing overall performance.

Other IC type: SPDT

As a single pole double throw (SPDT) device, it offers diverse switching options, adding functionality to various electronic applications.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow temperature time of 30 seconds ensures reliable solder joints, contributing to the longevity and reliability of the device.

Peak Reflow Temperature °C: 260

The capability to withstand a peak reflow temperature of 260 °C ensures compatibility with modern surface mount assembly processes.

Temperature Grade: INDUSTRIAL

Industrial temperature grading allows for use in harsh environments, ensuring this product is robust and reliable for demanding applications.

Terminal Form: NO LEAD

No-lead design is beneficial for reducing PCB space usage and improving assembly efficiency, allowing for more streamlined manufacturing processes.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm allows for high-density layouts, making this device suitable for miniaturized electronic applications.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature prevents short circuits during operation, ensuring reliability and safety in signal routing.

Technical Specifications

Multiplexers & Switches NX5DV713HF,118 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N32

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.12X.24,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NX5DV713HF,118 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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