Loading...

NX5DV330PW-T

NXP Semiconductors

NX5DV330PW-T by NXP Semiconductors

NX5DV330PW-T by NXP Semiconductors is a dual differential multiplexer designed for industrial applications. It operates at a nominal voltage of 5V, with a max on-state resistance of 10Ω and supports temperatures from -40 °C to 85 °C. Its compact SOIC package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,911

-

-

-

-

Anansix

USA . 2,196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,196

-

-

-

-

Vyrian

USA . 128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

128

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,079 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,079

$3.500

-

-

-

UNI Independent Distributors

Spain . 8,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,355

-

-

-

-

Corphita

USA . 4,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,680

-

-

-

-

Overview

Unlock seamless performance and reliability with the NX5DV330PW-T from NXP Semiconductors, a leader in innovative solutions. This high-quality differential multiplexer is engineered for versatility, making it ideal for industrial applications where precision matters. With its compact design and robust temperature range, you can trust it to enhance your systems while minimizing power consumption. Elevate your projects with NXP's commitment to excellence and experience unparalleled efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability in various environmental conditions.

Surface Mount: YES

This surface mount capability allows for easy integration into compact designs, saving board space.

No. of Functions: 2

With two functions, this device can handle multiple tasks, enhancing versatility in circuit design.

Package Shape: RECTANGULAR

The rectangular shape is common and facilitates easy mounting and layout on circuit boards.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5 V supply makes it compatible with a wide range of systems and components.

Power Supplies (V): 5

Supports a single power supply configuration, which simplifies power management in the application.

No. of Terminals: 16

The 16 terminals provide ample connectivity options for complex applications requiring multiple inputs/outputs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it an ideal choice for space-constrained applications without compromising performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for harsh environments and industrial applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in extreme cold conditions.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity options and facilitates more flexible PCB layouts.

Other IC type: DIFFERENTIAL MULTIPLEXER

As a differential multiplexer, it provides superior noise performance, making it ideal for sensitive applications.

Maximum On-state Resistance (Ron): 10 ohm

Low on-state resistance contributes to minimal power loss and ensures efficient signal transmission.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness and suitability for demanding industrial applications.

Maximum Supply Current (Isup): 0.003 mA

Extremely low supply current increases energy efficiency, making it ideal for battery-powered devices.

No. of Channels: 2

The presence of two channels allows simultaneous operation, increasing the functionality of the device.

Terminal Form: GULL WING

Gull wing terminals ensure a secure mechanical connection and easy soldering on PCB.

Terminal Pitch: 0.635 mm

The fine terminal pitch supports high-density layouts, making it suitable for advanced circuit designs.

Maximum Signal Current: 0.128 A

Able to handle a significant signal current, making it capable of driving a variety of loads effectively.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching mechanism prevents short circuits, enhancing reliability in operation.

Technical Specifications

Multiplexers & Switches NX5DV330PW-T attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

16

Maximum On-state Resistance (Ron):

10 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Signal Current:

.128 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.003 mA

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

NX5DV330PW-T Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 10