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NX5DV330D-T

NXP Semiconductors

NX5DV330D-T by NXP Semiconductors

NX5DV330D-T by NXP Semiconductors is a dual differential multiplexer designed for industrial applications. It operates at a nominal voltage of 5V, with a max on-state resistance of 10Ω and supports temperatures from -40 °C to 85 °C. Ideal for compact surface mount designs, it features 16 terminals in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,034 parts In-Stock

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4,034

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Vyrian

USA . 1,086 parts In-Stock

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Anansix

USA . 886 parts In-Stock

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One Stop Electronics

USA . 627 parts In-Stock

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$6.500

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627

$6.500

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UNI Independent Distributors

Spain . 4,215 parts In-Stock

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Corphita

USA . 2,595 parts In-Stock

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Overview

Elevate your designs with the NX5DV330D-T from NXP Semiconductors, a trusted leader in innovation. This versatile differential multiplexer ensures seamless performance across various applications, from industrial automation to consumer electronics. Its robust build and wide temperature range guarantee reliability even in challenging environments. Experience unmatched efficiency and precision, making it the ideal choice for enhancing your projects while maximizing value and reducing costs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, ideal for high-density circuit boards.

No. of Functions: 2

Having two functions enables versatile applications, allowing for cost-effective solutions without needing separate components.

Package Shape: RECTANGULAR

A rectangular package shape aids in efficient space utilization on PCB layouts, facilitating easier integration into designs.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage ensures compatibility with a wide range of devices and systems.

Power Supplies (V): 5

Support for a 5V power supply simplifies designs and aids in maintaining consistent performance across various applications.

No. of Terminals: 16

With 16 terminals, the device can accommodate various input/output configurations, enhancing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-saving designs, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C provides reliability in various environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C to 85 °C) ensures performance in extreme conditions, making it ideal for outdoor and rugged applications.

Terminal Position: DUAL

Dual terminal positioning allows for better layout flexibility and ease of soldering, improving manufacturability.

Other IC type: DIFFERENTIAL MULTIPLEXER

As a differential multiplexer, this IC minimizes signal loss and enhances performance in high-frequency applications.

Maximum On-state Resistance (Ron): 10 ohm

A low on-state resistance of 10 ohms ensures high signal integrity and minimizes power losses during operation.

Temperature Grade: INDUSTRIAL

Being classified as industrial grade means this product is built for durability and reliability in demanding environments.

Maximum Supply Current (Isup): 0.003 mA

With a maximum supply current of only 0.003 mA, this device is highly energy-efficient, making it suitable for battery-powered applications.

No. of Channels: 2

Having two channels allows for simultaneous data handling, boosting the efficiency and speed of operations.

Terminal Form: GULL WING

Gull wing terminals ensure secure connections and facilitate easier soldering, enhancing the robustness of the assembly.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is common in modern PCB designs, allowing for compatibility with a wide range of circuit boards.

Maximum Signal Current: 0.128 A

With a maximum signal current of 0.128 A, this multiplexer can handle significant loads, making it suitable for high-performance applications.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature prevents short circuits and ensures safe operation, making it ideal for sensitive applications.

Technical Specifications

Multiplexers & Switches NX5DV330D-T attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

16

Maximum On-state Resistance (Ron):

10 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Signal Current:

.128 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.003 mA

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

NX5DV330D-T Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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