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NX5DV713EHF,118

NXP Semiconductors

NX5DV713EHF,118 by NXP Semiconductors

NX5DV713EHF,118 by NXP Semiconductors is a versatile SPDT multiplexer with 3 functions and operates at power supplies of 3.3V and 5V. It features a compact chip carrier package with no lead terminals, suitable for industrial applications. With an operating temp range of -40 °C to 85 °C, it ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,696 parts In-Stock

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7,696

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Digiode

USA . 1,753 parts In-Stock

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1,753

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Anansix

USA . 672 parts In-Stock

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672

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Distributors (Availability)

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One Stop Electronics

USA . 1,315 parts In-Stock

1+ parts

$0.500

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1,315

$0.500

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Microchip USA

USA . 354 parts In-Stock

1+ parts

$1.134

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354

$1.134

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AZTECH Wire

Italy . 1,037 parts In-Stock

1+ parts

$9.560

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1,037

$9.560

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UNI Independent Distributors

Spain . 5,538 parts In-Stock

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5,538

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Corphita

USA . 1,568 parts In-Stock

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1,568

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Overview

Elevate your designs with the NX5DV713EHF,118 from NXP Semiconductors, a leader in innovative electronic solutions. This versatile multiplexer offers robust performance in demanding applications, ensuring reliability across temperature extremes. With its compact, surface-mount design and multiple functions, it simplifies circuit complexity while enhancing efficiency. Trust in NXP's commitment to quality, delivering superior value and seamless integration for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Constructed from durable plastic/epoxy material, this multiplexer is designed for reliability and longevity in various applications.

Surface Mount: YES

The surface mount design allows for easy integration into compact circuit boards, saving space and improving performance.

No. of Functions: 3

With three functions, this device provides versatility, making it suitable for a range of applications requiring complex signal management.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board layout, facilitating efficient space utilization in design.

Power Supplies (V): 3.3, 5

Compatible with both 3.3V and 5V power supplies, offering flexibility for various systems without additional components.

No. of Terminals: 32

A generous number of 32 terminals allows for extensive connectivity options, making it ideal for multifunctional applications.

Package Style (Meter): CHIP CARRIER

As a chip carrier, it enables effective heat dissipation and electrical performance optimization in tight layouts.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can perform reliably in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C ensures functionality in extreme conditions, making it suitable for industrial applications.

Terminal Position: QUAD

Quad terminal positioning provides efficient layout options on PCBs, enhancing design adaptability.

Output (V): SEPARATE OUTPUT

Separate output capability allows for specialized handling of signals, increasing the device's versatility.

Other IC type: SPDT

This single-pole double-throw (SPDT) configuration is essential for efficient signal routing in complex circuits.

Maximum Time At Peak Reflow Temperature (s): 30

The design accommodates a maximum time of 30 seconds at peak reflow, ensuring compatibility with standardized soldering processes.

Peak Reflow Temperature °C: 260

Holding up to a peak reflow temperature of 260 °C, this product is suitable for lead-free soldering methods.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this product demonstrates reliability in harsh environments.

Terminal Form: NO LEAD

No-lead terminals facilitate a compact design, reducing the overall footprint on PCBs for space-constrained applications.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm enables higher density mounting, ideal for advanced and miniaturized electronic designs.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching allows for safer operation by preventing short circuits during transitions between states.

Technical Specifications

Multiplexers & Switches NX5DV713EHF,118 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N32

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.12X.24,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NX5DV713EHF,118 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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