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NX5DV330DS-T

NXP Semiconductors

NX5DV330DS-T by NXP Semiconductors

NX5DV330DS-T from NXP Semiconductors is a dual differential multiplexer designed for industrial applications, operating b/w -40 °C to 85 °C. It features a low on-state resistance of 10Ω and supports a nominal voltage of 5V. This compact surface mount device has 16 terminals and ensures reliable switching with break-before-make functionality.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,665 parts In-Stock

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3,665

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Vyrian

USA . 2,249 parts In-Stock

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2,249

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Anansix

USA . 178 parts In-Stock

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178

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,262 parts In-Stock

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$4.500

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UNI Independent Distributors

Spain . 7,484 parts In-Stock

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7,484

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Corphita

USA . 259 parts In-Stock

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Overview

Unlock unparalleled performance with the NX5DV330DS-T from NXP Semiconductors, a leader in innovation and reliability. This differential multiplexer delivers exceptional quality for a range of applications, ensuring seamless operations in demanding environments. Its compact design and robust temperature tolerance make it ideal for industrial solutions. Experience the benefits of reduced power consumption and enhanced signal integrity, empowering your projects to excel. Choose NXP for unmatched support and expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robustness and protects the integrated circuit from environmental factors.

Surface Mount: YES

Surface mount technology allows for compact PCB designs and efficient use of space, making installation easier.

No. of Functions: 2

With two functions, this device offers versatility for various applications, reducing the number of components needed in a design.

Package Shape: RECTANGULAR

The rectangular package shape helps in ensuring efficient PCB layout and better space utilization.

Nominal Supply Voltage (Vsup): 5 V

Operating at a common 5V supply voltage makes this product compatible with a wide range of devices and systems.

Power Supplies (V): 5

Single power supply operation simplifies design and reduces complexity in system integration.

No. of Terminals: 16

Having 16 terminals facilitates various connections and makes the device adaptable for different configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package enhance compactness, allowing for high-density mounting on PCBs.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C ensures reliability in high-temperature environments.

Minimum Operating Temperature: -40 °C

With a minimum temperature of -40 °C, this product is suitable for industrial and outdoor applications.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in PCB layout and enhances connectivity options.

Other IC type: DIFFERENTIAL MULTIPLEXER

The differential multiplexer design allows for lower signal distortion and improved performance in communication applications.

Maximum On-state Resistance (Ron): 10 ohm

A maximum on-state resistance of 10 ohms ensures low signal loss and efficient power transmission.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures durability and reliable operation in challenging environments.

Maximum Supply Current (Isup): 0.003 mA

Low supply current consumption makes this product energy-efficient, which is ideal for battery-powered devices.

No. of Channels: 2

With two channels, this device provides flexibility and efficiency in managing multiple signal paths.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and mechanical stability, ensuring reliable performance in assemblies.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm supports fine-pitch designs, allowing for high-density circuit layouts.

Maximum Signal Current: 0.128 A

A maximum signal current of 0.128 A supports robust signal handling, suitable for demanding applications.

Switching: BREAK-BEFORE-MAKE

The break-before-make switching characteristic prevents unintended shorts and ensures safe operation in switching applications.

Technical Specifications

Multiplexers & Switches NX5DV330DS-T attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

16

Maximum On-state Resistance (Ron):

10 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Signal Current:

.128 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.003 mA

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

NX5DV330DS-T Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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