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NX5DV713EHF

NXP Semiconductors

NX5DV713EHF by NXP Semiconductors

NX5DV713EHF by NXP Semiconductors is a versatile multiplexer with 3 functions, ideal for industrial applications. It operates b/w -40 °C to 85 °C and supports a supply voltage range of 2V to 5.5V. Its compact design features a quad terminal layout in a thin profile package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,123 parts In-Stock

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2,123

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Vyrian

USA . 853 parts In-Stock

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853

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Digiode

USA . 722 parts In-Stock

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722

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,498 parts In-Stock

1+ parts

$5.500

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1,498

$5.500

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UNI Independent Distributors

Spain . 2,450 parts In-Stock

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2,450

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Corphita

USA . 2,124 parts In-Stock

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2,124

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Authorized Procurement Solutions

USA . 142 parts In-Stock

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142

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GreenTree Electronics

Israel . 142 parts In-Stock

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142

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Perfect Parts

USA . 132 parts In-Stock

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132

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Overview

Unlock superior performance with the NX5DV713EHF from NXP Semiconductors, a trusted leader in innovative solutions. This multiplexer seamlessly integrates into diverse applications, delivering exceptional reliability and efficiency across industrial environments. With its compact design and robust temperature range, it stands ready to optimize your systems, ensuring enhanced functionality and reduced power consumption. Elevate your projects with the quality and expertise that only NXP can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes it lightweight and provides good durability.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient PCB space utilization.

No. of Functions: 3

Multiple functions in a single chip enhance versatility in various applications.

Package Shape: RECTANGULAR

The rectangular shape contributes to optimal layout on PCBs, making assembly easier.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at 3.3 V ensures compatibility with most digital systems and low power consumption.

No. of Terminals: 32

A higher number of terminals allows for more connections and improved performance in complex circuits.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

A thin profile reduces space requirements, while heat sink features improve thermal performance.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance in extreme conditions.

Terminal Position: QUAD

Quad terminal positions facilitate layout design and signal routing on circuit boards.

Maximum Seated Height: 0.8 mm

Low seated height enables dense circuit designs and helps in compact product development.

Width: 3 mm

A slim width helps save space on the PCB, allowing for densely packed components.

Other IC type: SPDT

The SPDT configuration offers flexible switching capabilities essential for various applications.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage allows for use in battery-powered devices, enhancing versatility.

Length: 6 mm

A compact length contributes to smaller overall device size without compromising functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, which demand high reliability and robustness.

Maximum Supply Current (Isup): 0.002 mA

Very low supply current indicates low power consumption, crucial for energy-efficient designs.

Terminal Form: NO LEAD

Lead-free design promotes environmental sustainability and compliance with modern regulations.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables high-density PCB designs, perfect for compact electronic devices.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle up to 5.5 V makes this device suitable for a range of applications.

Switching: BREAK-BEFORE-MAKE

This switching characteristic prevents short circuits and ensures safe operation in signal routing.

Nominal On-state Resistance Match: 0.5 ohm

Low on-state resistance minimizes power loss and improves overall circuit efficiency.

Technical Specifications

Multiplexers & Switches NX5DV713EHF attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Additional Features:

IT ALSO HAS 4.5 TO 5.5

Other IC type:

JESD-30 Code:

R-PQCC-N32

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

3

No. of Terminals:

32

Nominal On-state Resistance Match:

.5 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.12X.24,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

.002 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width (mm):

3 mm

Trade Compliance

NX5DV713EHF Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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