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MPC506AU/1KG4

Texas Instruments

MPC506AU/1KG4 by Texas Instruments

The Texas Instruments MPC506AU/1KG4 is a CMOS single-ended multiplexer with 16 channels. It operates at temperatures ranging from -40 to 85°C and has a max on-state resistance of 1500 ohm. This small outline package switch is ideal for industrial applications requiring high isolation and fast switching times.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

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1k+

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Chip Stock

USA . 10,300 parts In-Stock

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Vyrian

USA . 5,115 parts In-Stock

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Digiode

USA . 1,585 parts In-Stock

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Nova Conductors

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One Stop Electronics

USA . 1,360 parts In-Stock

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$1.500

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Semicontronic

India . 935 parts In-Stock

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$4.500

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$4.388

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$4.365

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AZTECH Wire

Italy . 732 parts In-Stock

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$13.221

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Parana Technologies

USA . 1,461 parts In-Stock

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$18.793

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$18.881

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Corohmni

South Africa . 129 parts In-Stock

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$20.496

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DigiPath Technology Company

USA . 1,469 parts In-Stock

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$19.038

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ChromeModa Solutions

Germany . 4,605 parts In-Stock

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IDEA Electronic Components Group

UK . 2,153 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Lucentia Tech

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Overview

Elevate your electronic designs with the MPC506AU/1KG4 by Texas Instruments, a high-quality multiplexer and switch that offers unmatched performance and reliability. Designed with precision and expertise, this versatile component is perfect for a wide range of applications in industries such as telecommunications, industrial automation, and instrumentation. Experience seamless operation, enhanced functionality, and superior efficiency with this cutting-edge product. Upgrade your projects today with the MPC506AU/1KG4 and discover the difference that Texas Instruments can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of the multiplexer switch onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 15 V

With a nominal supply voltage of 15V, this multiplexer switch is compatible with a wide range of electronic systems and can deliver stable performance.

No. of Channels: 16

Having 16 channels allows for efficient signal switching and routing in complex electronic systems, offering versatility and flexibility in operation.

Maximum On-state Resistance (Ron): 1500 ohm

The low on-state resistance ensures minimal signal loss and distortion during switching operations, maintaining signal integrity and quality.

Maximum Switch-on Time: 500 ns

The fast switch-on time of 500ns ensures quick response and minimal delay in signal switching, enhancing the overall performance of the multiplexer switch.

Technical Specifications

Multiplexers & Switches MPC506AU/1KG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

2

Nominal Negative Supply Voltage (Vsup):

-15 V

No. of Channels:

16

No. of Functions:

1

No. of Terminals:

28

Nominal Off-state Isolation:

68 dB

Maximum On-state Resistance (Ron):

1500 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-15

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Signal Current:

.02 A

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Maximum Switch-off Time:

500 ns

Maximum Switch-on Time:

500 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

MPC506AU/1KG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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