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MPC506APG4

Texas Instruments

MPC506APG4 by Texas Instruments

The Texas Instruments MPC506APG4 is a CMOS multiplexer with 16 channels, 1500 ohm max on-state resistance, and 500 ns switch-on/off time. It operates in industrial temperature range (-40 to 85 °C) and has a nominal voltage of +-15 V. Ideal for applications requiring high-speed signal switching in electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,507 parts In-Stock

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Digiode

USA . 1,245 parts In-Stock

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1,245

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Distributors (Availability)

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Ampacity Inc.

Singapore . 298 parts In-Stock

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$0.500

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298

$0.500

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Semicontronic

India . 586 parts In-Stock

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$6.500

100+ parts

$6.338

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$6.305

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586

$6.500

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$6.305

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One Stop Electronics

USA . 448 parts In-Stock

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$6.500

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448

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AZTECH Wire

Italy . 481 parts In-Stock

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$14.382

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481

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Parana Technologies

USA . 1,535 parts In-Stock

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$17.267

100+ parts

$1,603.493

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$15.540

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1,535

$17.267

$1,603.493

$15.540

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DigiPath Technology Company

USA . 2,346 parts In-Stock

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$19.013

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$19.013

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ChromeModa Solutions

Germany . 2,807 parts In-Stock

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$19.401

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$15.909

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IDEA Electronic Components Group

UK . 1,758 parts In-Stock

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$19.401

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$18.431

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$17.461

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Corphita

USA . 1,853 parts In-Stock

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Microchip USA

USA . 349 parts In-Stock

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Corohmni

South Africa . 323 parts In-Stock

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Overview

Upgrade your electronic designs with the Texas Instruments MPC506APG4 Multiplexer & Switch. Crafted with precision and expertise, this quality product offers unparalleled performance and reliability for a wide range of applications. With 16 channels, advanced CMOS technology, and industrial-grade temperature tolerance, this multiplexer guarantees seamless operation in even the harshest environments. Say goodbye to signal interference and hello to smooth, efficient data switching with the MPC506APG4. Trust Texas Instruments for superior quality and innovation that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection to the internal components of the multiplexer, ensuring longevity and reliable performance.

Nominal Supply Voltage (Vsup): 15 V

Operates at a standard voltage level, making it compatible with a wide range of electronic systems.

No. of Channels: 16

Provides high channel count, allowing for multiple signals to be processed simultaneously, increasing efficiency in data transmission.

Maximum Seated Height: 6.35 mm

Low profile design enables space-saving installation in compact electronic devices or systems.

Maximum On-state Resistance (Ron): 1500 ohm

Low on-state resistance ensures minimal signal loss and distortion during data transmission, maintaining signal integrity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance and efficiency of the multiplexer.

Nominal Off-state Isolation: 68 dB

High off-state isolation minimizes crosstalk and interference between channels, ensuring clean and accurate signal routing.

Technical Specifications

Multiplexers & Switches MPC506APG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e4

Length:

37.4 mm

Nominal Negative Supply Voltage (Vsup):

-15 V

No. of Channels:

16

No. of Functions:

1

No. of Terminals:

28

Nominal Off-state Isolation:

68 dB

Maximum On-state Resistance (Ron):

1500 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-15

Qualification:

Not Qualified

Maximum Seated Height:

6.35 mm

Maximum Signal Current:

.02 A

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Maximum Switch-off Time:

500 ns

Maximum Switch-on Time:

500 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

15.24 mm

Trade Compliance

MPC506APG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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