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MPC507APG4

Texas Instruments

MPC507APG4 by Texas Instruments

MPC507APG4 by Texas Instruments is an 8-channel differential multiplexer with a max on-state resistance of 1500 ohm and a switching voltage of +-15 V. It is designed for industrial applications, featuring a temperature range from -40 to 85 °C and a package style of IN-LINE.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,356 parts In-Stock

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3,356

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Vyrian

USA . 2,757 parts In-Stock

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2,757

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,621 parts In-Stock

1+ parts

$4.500

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1,621

$4.500

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One Stop Electronics

USA . 522 parts In-Stock

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$4.500

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522

$4.500

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AZTECH Wire

Italy . 417 parts In-Stock

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$6.043

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417

$6.043

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Semicontronic

India . 946 parts In-Stock

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$6.500

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$6.338

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$6.305

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946

$6.500

$6.338

$6.305

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Parana Technologies

USA . 705 parts In-Stock

1+ parts

$15.468

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$15.853

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705

$15.468

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$15.853

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DigiPath Technology Company

USA . 2,339 parts In-Stock

1+ parts

$17.032

100+ parts

$15.670

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2,339

$17.032

$15.670

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ChromeModa Solutions

Germany . 2,435 parts In-Stock

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$17.380

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$14.252

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2,435

$17.380

$14.252

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IDEA Electronic Components Group

UK . 865 parts In-Stock

1+ parts

$17.380

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$16.511

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$15.642

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865

$17.380

$16.511

$15.642

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Corphita

USA . 3,240 parts In-Stock

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GreenTree Electronics

Israel . 1,080 parts In-Stock

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Microchip USA

USA . 174 parts In-Stock

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Corohmni

South Africa . 80 parts In-Stock

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Overview

Experience seamless and reliable performance with the MPC507APG4 by Texas Instruments, a leading manufacturer in the industry. This differential multiplexer offers high-quality switching capabilities ideal for industrial applications, providing customers with unparalleled value and efficiency. With its 8 channels and robust design, this versatile component ensures optimal functionality and precision, making it a top choice for engineers and developers looking for superior performance. Trust Texas Instruments to deliver cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components, making the product long-lasting and reliable.

Nominal Supply Voltage (Vsup): 15 V

Operating within the specified voltage range ensures proper functionality and performance.

No. of Terminals: 28

Having a higher number of terminals allows for more connectivity options and versatility in applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand challenging environmental conditions.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, resulting in efficient operation.

No. of Channels: 8

Having multiple channels allows for simultaneous data transmission, increasing productivity and efficiency.

Technical Specifications

Multiplexers & Switches MPC507APG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e4

Length:

37.4 mm

Nominal Negative Supply Voltage (Vsup):

-15 V

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

28

Nominal Off-state Isolation:

68 dB

Maximum On-state Resistance (Ron):

1500 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-15

Qualification:

Not Qualified

Maximum Seated Height:

6.35 mm

Maximum Signal Current:

.02 A

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Maximum Switch-off Time:

500 ns

Maximum Switch-on Time:

500 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

15.24 mm

Trade Compliance

MPC507APG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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