Loading...

NX5DV4885EHF

NXP Semiconductors

NX5DV4885EHF by NXP Semiconductors

NX5DV4885EHF by NXP Semiconductors is a compact SPDT multiplexer with a 3.3V nominal voltage and operates b/w -40 °C to 85 °C. It features a very thin profile, 24 terminals, and nickel palladium gold finish for reliable performance in industrial applications. Ideal for space-constrained designs requiring efficient signal routing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,067 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,067

-

-

-

-

Anansix

USA . 847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

847

-

-

-

-

Vyrian

USA . 697 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

697

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,641 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,641

$3.500

-

-

-

UNI Independent Distributors

Spain . 1,994 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,994

-

-

-

-

Corphita

USA . 1,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,820

-

-

-

-

Perfect Parts

USA . 129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

129

-

-

-

-

Overview

Elevate your designs with the NX5DV4885EHF from NXP Semiconductors, where innovation meets reliability. This state-of-the-art multiplexer offers exceptional performance in demanding environments, making it perfect for industrial applications. With NXP's renowned quality assurance and commitment to excellence, you benefit from enhanced durability and efficiency. Trust in a partner that empowers your projects, delivering unmatched value and versatility for all your switching needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, ideal for modern electronic devices.

Package Shape: SQUARE

The square package shape aids in uniform thermal distribution and is easy to integrate into circuit designs.

Nominal Supply Voltage (Vsup): 3.3 V

Designed for low voltage applications, this nominal supply voltage is ideal for energy-efficient systems.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options, allowing for versatile use in complex circuits.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile facilitates applications where space is critical, and the heat sink/slug design enhances thermal management.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for harsh environments and industrial applications.

Minimum Operating Temperature: -40 °C

The capability to function in extreme cold makes this device suitable for outdoor and specialized applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel-palladium gold finish ensures excellent conductivity and resistance to corrosion, enhancing reliability.

Terminal Position: QUAD

With quad terminal positioning, integration on PCBs is straightforward and reliable, reducing assembly complexity.

Maximum Seated Height: 1 mm

A low seated height allows for a thinner overall profile, which is essential for portable electronics.

Width: 4 mm

The compact width is suitable for high-density circuit designs, allowing for flexibility in layout.

Other IC Type: SPDT

The SPDT configuration provides flexible switching options for diverse applications, enhancing functionality.

Minimum Supply Voltage (Vsup): 2 V

This low minimum supply voltage enables the product to operate in energy-sensitive applications.

Length: 4 mm

A length of 4 mm contributes to the compact form factor, suitable for size-constrained designs.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this product is built to withstand demanding conditions.

Terminal Form: NO LEAD

Lead-free terminals make this device compliant with environmentally friendly standards and regulations.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for tighter spacing on PCBs, enhancing overall design compactness.

Maximum Supply Voltage (Vsup): 5.5 V

With a high maximum supply voltage, this component can handle various applications with greater flexibility.

Nominal On-state Resistance Match: 0.5 ohm

A low on-state resistance minimizes power loss, improving efficiency and overall system performance.

Technical Specifications

Multiplexers & Switches NX5DV4885EHF attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES WITH 4.5 TO 5.5V SUPPLY

Other IC type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Nominal On-state Resistance Match:

.5 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

4 mm

Trade Compliance

NX5DV4885EHF Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 10