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CD74HC4051M96

Texas Instruments

CD74HC4051M96 by Texas Instruments

CD74HC4051M96 by Texas Instruments is a CMOS single-ended multiplexer with 16 terminals, operating at -55 to 125 °C. It has a max on-state resistance of 270 ohm and a bandwidth of 200 kHz. Ideal for military-grade applications requiring common output switching with low signal current and high isolation levels.

Median Price

$0.264

Lifecycle Status

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Arrow

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Adafruit Industries

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Verical

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Chip1Stop

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Digiode

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TEDSS.com

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TME

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Maritex

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Component Electronics Inc.

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 3,101 parts In-Stock

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IDEA Electronic Components Group

UK . 1,807 parts In-Stock

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Corohmni

South Africa . 417 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Perfect Parts

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Glotronic Ltd.

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Continental Prestige Electronics

USA . 953 parts In-Stock

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$0.226

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Supply Digital

USA . 811 parts In-Stock

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Israel . 710 parts In-Stock

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USA . 500 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 327 parts In-Stock

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Overview

Discover the Texas Instruments CD74HC4051M96, the ultimate solution for your multiplexing and switching needs. With a reputation for top-quality manufacturing, Texas Instruments delivers a product that offers unmatched reliability and performance. Ideal for a wide range of applications, this versatile device provides exceptional value by combining efficiency with seamless operation. Upgrade your projects with the CD74HC4051M96 and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and reliability to the product.

Surface Mount

YES - Allows for easy installation onto circuit boards, saving time and effort.

Nominal Supply Voltage (Vsup)

4.5 V - Ideal voltage for efficient operation and performance.

Power Supplies (V)

2/6,GND/-6 - Offers flexibility in power options for various applications.

No. of Terminals

16 - Sufficient number of terminals for connecting to other components.

Package Style (Meter)

SMALL OUTLINE - Compact design saves space on the circuit board.

Maximum Operating Temperature

125 °C - Can withstand high temperatures, suitable for various environments.

Minimum Operating Temperature

55 °C - Works reliably even in extremely cold conditions.

Terminal Finish

NICKEL PALLADIUM GOLD - Ensures strong and stable connections for smooth operation.

Terminal Position

DUAL - Allows for easy and secure attachment of external wires.

Output (V)

COMMON OUTPUT - Simplifies circuit design by having a single output.

Maximum Seated Height

1.58 mm - Low profile design is beneficial for applications with space constraints.

Width (mm)

3.91 mm - Narrow width saves space on the circuit board.

Other IC type

SINGLE-ENDED MULTIPLEXER - Offers versatility in signal routing and processing.

Minimum Supply Voltage (Vsup)

2 V - Can operate efficiently even at low voltages, saving power.

Minimum Negative Supply Voltage (Vsup)

0 V - Provides flexibility in power configurations.

Maximum Time At Peak Reflow Temperature (s)

30 - Withstands high temperatures during soldering processes.

Peak Reflow Temperature °C

260 - Can withstand high temperatures during manufacturing processes.

Maximum On-state Resistance (Ron)

270 ohm - Low resistance ensures efficient signal transmission.

Maximum Switch-on Time

32 ns - Fast switch-on time for quick signal routing.

Length

9.9 mm - Compact length saves space on the circuit board.

Maximum Switch-off Time

32 ns - Quick switch-off time for efficient signal control.

Temperature Grade

MILITARY - Designed to meet stringent military specifications for reliability.

Maximum Supply Current (Isup)

0.08 mA - Low power consumption for energy efficiency.

Technology

CMOS - Reliable technology for high-performance signal processing.

Nominal Bandwidth

200 kHz - Adequate bandwidth for signal transmission needs.

Terminal Form

GULL WING - Secure terminal form for stable connections.

Maximum Negative Supply Voltage (Vsup)

6 V - Suitable for applications requiring negative voltage operations.

Nominal Negative Supply Voltage (Vsup)

4.5 V - Provides stable negative voltage for proper operation.

Terminal Pitch

1.27 mm - Standard pitch for easy connections to other components.

Maximum Supply Voltage (Vsup)

6 V - Can handle high voltage inputs for versatile applications.

Maximum Signal Current

0.025 A - Capable of handling high current signals for robust performance.

Normal Position (V)

NC - Default position for normal signal routing.

Nominal Off-state Isolation

73 dB - Provides high isolation between signal paths for clean transmissions.

Minimum Input Voltage

0 V - Can accept low input voltages for versatile compatibility.

Switching (V)

BREAK-BEFORE-MAKE - Ensures smooth and reliable switching operations.

Nominal On-state Resistance Match

5 ohm - Provides accurate matching of resistance for consistent performance.

Maximum Input Voltage

6 V - Can handle high input voltages without damage.

Technical Specifications

Multiplexers & Switches CD74HC4051M96 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 2V TO 10V (VCC-VEE) SUPPLY

Other IC type:

Nominal Bandwidth:

200 kHz

Maximum Input Voltage:

6 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Maximum Negative Supply Voltage (Vsup):

-6 V

Minimum Negative Supply Voltage (Vsup):

0 V

Nominal Negative Supply Voltage (Vsup):

-4.5 V

Normal Position (V):

NC

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

73 dB

Nominal On-state Resistance Match:

5 ohm

Maximum On-state Resistance (Ron):

270 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

COMMON OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6,GND/-6

Qualification:

Not Qualified

Maximum Seated Height:

1.58 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

32 ns

Maximum Switch-on Time:

32 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.91 mm

Trade Compliance

CD74HC4051M96 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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