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NTS0104PW

NXP Semiconductors

NTS0104PW by NXP Semiconductors

NTS0104PW by NXP Semiconductors is a Network Interfaces IC with 4 functions, operating b/w -40 to 125°C. It features a small outline package with 14 terminals and is suitable for automotive telecom applications requiring a nominal voltage of 3.3V.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 53,500 parts In-Stock

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Cyclops Electronics Ltd

UK . 17,158 parts In-Stock

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Vyrian

USA . 1,516 parts In-Stock

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Digiode

USA . 985 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Anansix

USA . 142 parts In-Stock

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142

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AZTECH Wire

Italy . 332 parts In-Stock

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$7.608

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Corohmni

South Africa . 8 parts In-Stock

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$8.431

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Aztec Data Supply Inc.

USA . 1,244 parts In-Stock

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$10.760

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Ampacity Inc.

Singapore . 341 parts In-Stock

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One Stop Electronics

USA . 813 parts In-Stock

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$808.000

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Semicontronic

India . 630 parts In-Stock

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$897.000

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$874.575

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$870.090

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A-Z Elektronik GmbH

Germany . 15,633 parts In-Stock

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Kepictronics

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Formix International (Excess)

India . 6,917 parts In-Stock

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Infinite Electronics LLP (Excess)

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UNI Independent Distributors

Spain . 4,889 parts In-Stock

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Corphita

USA . 4,080 parts In-Stock

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Lixinc

USA . 3,946 parts In-Stock

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Continental Prestige Electronics

USA . 3,640 parts In-Stock

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Argo Parts USA

USA . 2,877 parts In-Stock

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Bastille Electronics

Australia . 97 parts In-Stock

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Overview

Discover the NTS0104PW by NXP Semiconductors, a cutting-edge network interface designed with precision and quality in mind. With a sleek small outline package and dual terminal position, this innovative product offers seamless integration and reliability for a wide range of applications. Whether you're in automotive or telecom, the NTS0104PW delivers superior performance and efficiency with its nickel palladium gold finish and 3.3V nominal supply voltage. Trust in NXP Semiconductors to provide you with the latest technology that enhances your projects and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and improving assembly efficiency.

No. of Functions: 4

Multiple functions in a single product offer versatility and convenience, reducing the need for additional components.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easily integrated into various electronic devices.

No. of Terminals: 14

Having 14 terminals enables connectivity to multiple systems or components, enhancing functionality and compatibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch design make the product suitable for compact applications, saving space and improving overall design efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in harsh environments or under heavy loads.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function effectively in extreme cold conditions, ideal for various operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity, corrosion resistance, and longevity, ensuring stable electrical connections.

Terminal Position: DUAL

Dual terminal position allows for flexible installation options and accommodates different wiring configurations, improving ease of use.

Maximum Seated Height: 1.1 mm

Low maximum seated height minimizes the overall profile of the product, enhancing its compatibility with slim devices or tight spaces.

Width: 4.4 mm

Compact width dimension makes the product suitable for use in space-constrained applications without sacrificing functionality.

Length: 5 mm

Short length dimension contributes to the product's overall compactness and versatility in various electronic designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures the product can withstand extreme temperature fluctuations typically encountered in automotive environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates soldering and mounting processes, ensuring secure connections and ease of assembly.

Telecom IC Type: INTERFACE CIRCUIT

Interface circuit telecom IC type enables seamless communication and data transfer between devices, enhancing connectivity and system integration capabilities.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures consistent performance and compatibility with a wide range of electronic systems and devices.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65 mm facilitates precise connections and enables high-density mounting, optimizing board space usage and enhancing design flexibility.

Technical Specifications

Network Interfaces NTS0104PW attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

NTS0104PW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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