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NTS0101GF

NXP Semiconductors

NTS0101GF by NXP Semiconductors

NTS0101GF by NXP Semiconductors is a compact, automotive-grade network interface IC with a max operating temp of 125 °C and a min of -40 °C. It features a very thin profile (0.5mm height) and operates at 1.8V, ideal for telecom applications. Its dual terminal design ensures efficient connectivity in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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ACDS - Activité Composants Distribution Service

France . 4,990 parts In-Stock

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Digiode

USA . 3,024 parts In-Stock

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Vyrian

USA . 1,216 parts In-Stock

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Anansix

USA . 323 parts In-Stock

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One Stop Electronics

USA . 191 parts In-Stock

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$998.000

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191

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Metaverse IC Inc.

Canada . 35,000 parts In-Stock

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Perfect Parts

USA . 11,178 parts In-Stock

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UNI Independent Distributors

Spain . 7,420 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,344 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 4,990 parts In-Stock

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4,990

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 826 parts In-Stock

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Kepictronics

USA . 400 parts In-Stock

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Overview

Elevate your connectivity solutions with the NTS0101GF from NXP Semiconductors, a trusted leader in high-quality network interfaces. Designed for automotive applications, this ultra-thin, reliable component operates seamlessly between -40 °C to 125 °C, ensuring optimal performance in demanding environments. Experience superior efficiency and durability that translates into reduced development time and cost savings, empowering your innovations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials enhances the reliability and longevity of the product, making it suitable for critical applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier automated assembly, which improves manufacturing efficiency.

Package Shape: SQUARE

The square shape provides optimal space efficiency, allowing for high-density circuit designs in limited spaces.

No. of Terminals: 6

Having six terminals enables versatile connectivity options, facilitating integration into various systems.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile contribute to a lightweight design, ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating ensures reliability in hot environments, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is designed for extreme conditions, ensuring functionality in cold climates.

Terminal Finish: TIN

The tin terminal finish offers good solderability and corrosion resistance, ensuring optimal performance over time.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity options, allowing for flexible configurations in design.

Maximum Seated Height: 0.5 mm

A low seated height of only 0.5 mm allows for slim designs, essential for modern electronic devices requiring compact dimensions.

Width: 1 mm

The 1 mm width facilitates integration into narrow spaces, allowing for more efficient circuit layouts.

Length: 1 mm

A compact length of 1 mm enables high-density packing of components, perfect for miniaturized system designs.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, this product ensures performance and durability in challenging environments typical of vehicular applications.

Terminal Form: NO LEAD

The no-lead design simplifies manufacturing processes and is environmentally friendly, aligning with modern production practices.

Telecom IC Type: INTERFACE CIRCUIT

As an interface circuit, it plays a crucial role in telecommunications, ensuring reliable data communication in various applications.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage of 1.8 V minimizes power consumption, contributing to energy-efficient designs.

Terminal Pitch: 0.35 mm

A terminal pitch of 0.35 mm allows for denser packing on printed circuit boards, optimizing space and increasing functionality.

Technical Specifications

Network Interfaces NTS0101GF attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NTS0101GF Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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