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NTS0101GW

NXP Semiconductors

NTS0101GW by NXP Semiconductors

NTS0101GW by NXP Semiconductors is a compact network interface IC designed for automotive applications. It operates b/w -40 °C to 125 °C, features a 1.8V supply voltage, and has a small outline with 6 gull-wing terminals. Ideal for reliable telecom interfacing in constrained spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 974 parts In-Stock

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974

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Anansix

USA . 697 parts In-Stock

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Vyrian

USA . 625 parts In-Stock

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625

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One Stop Electronics

USA . 784 parts In-Stock

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$297.000

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784

$297.000

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Kepictronics

USA . 31,628 parts In-Stock

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31,628

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A-Z Elektronik GmbH

Germany . 4,680 parts In-Stock

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4,680

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UNI Independent Distributors

Spain . 2,744 parts In-Stock

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Corphita

USA . 2,596 parts In-Stock

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2,596

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Perfect Parts

USA . 1,194 parts In-Stock

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Authorized Procurement Solutions

USA . 921 parts In-Stock

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921

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GreenTree Electronics

Israel . 921 parts In-Stock

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921

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Overview

Elevate your designs with the NTS0101GW from NXP Semiconductors, a leading name in innovation and reliability. This compact network interface is engineered for superior performance in automotive applications, ensuring robust connectivity even in extreme temperatures. With its sleek, space-saving design and durable materials, it offers unmatched quality and versatility, empowering you to create cutting-edge solutions that stand out in today’s competitive market. Unlock potential and drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making this interface ideal for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling high-density board layouts, which is essential for space-constrained environments.

Package Shape: RECTANGULAR

The rectangular shape helps optimize board space and facilitates efficient placement on PCB layouts.

No. of Terminals: 6

Having six terminals allows for versatile connectivity options, ensuring compatibility with various systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile ensure that it can fit into tight spaces, making it suitable for portable devices.

Maximum Operating Temperature: 125 °C

Withstanding temperatures up to 125 °C ensures reliability in high-temperature environments, critical for automotive applications.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C makes it suitable for extreme environmental conditions, such as in automotive and industrial sectors.

Terminal Finish: PURE TIN

Pure tin finish enhances solderability and provides good corrosion resistance, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positioning allows for better balance in component placement, improving reliability in connection.

Maximum Seated Height: 1.1 mm

A low seated height allows for more compact designs, crucial for miniaturized electronic devices.

Width: 1.25 mm

A narrow width enhances space efficiency on printed circuit boards (PCBs), making it perfect for space-sensitive applications.

Length: 2 mm

The small length further contributes to reduced space requirements on PCB layouts, enabling tighter designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring it meets the rigorous standards and reliability required in vehicles.

Terminal Form: GULL WING

Gull wing terminals offer good mechanical strength and ease of soldering, which improves the robustness of the connections.

Telecom IC Type: INTERFACE CIRCUIT

As an interface circuit, it provides essential connectivity features critical for effective data transfer in networks.

Nominal Supply Voltage: 1.8 V

Low supply voltage operation reduces power consumption, enhancing the energy efficiency of the device.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for denser arrangements on PCBs while maintaining easy soldering and assembly.

Technical Specifications

Network Interfaces NTS0101GW attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G6

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

NTS0101GW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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