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NTS0101GM

NXP Semiconductors

NTS0101GM by NXP Semiconductors

NTS0101GM by NXP Semiconductors is a compact, automotive-grade network interface with a max operating temp of 125 °C and a nominal voltage of 1.8V. Its small outline design features 6 terminals in a dual position. Ideal for telecom applications, it ensures reliable performance in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,519 parts In-Stock

1+ parts

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3,519

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Vyrian

USA . 2,075 parts In-Stock

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2,075

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Anansix

USA . 1,739 parts In-Stock

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1,739

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,612 parts In-Stock

1+ parts

$335.000

100+ parts

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1,612

$335.000

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UNI Independent Distributors

Spain . 3,052 parts In-Stock

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3,052

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Corphita

USA . 2,700 parts In-Stock

1+ parts

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2,700

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Elevate your designs with the NTS0101GM from NXP Semiconductors—a leader in innovation and quality. This compact network interface seamlessly integrates into automotive applications, ensuring reliable performance under extreme temperatures. Enjoy enhanced connectivity with a robust design that prioritizes efficiency and durability, making it ideal for next-gen telecom solutions. Trust in NXP's legacy of excellence to deliver unmatched value and reliability to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using durable plastic/epoxy materials ensures robustness and longevity in harsh environments.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout flexibility in circuit design, enabling better integration.

No. of Terminals: 6

Having 6 terminals enhances connection options and facilitates multiple signal handling.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The very thin profile design is perfect for space-constrained applications, allowing for more compact devices.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability and performance in demanding thermal conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range makes this product suitable for automotive and industrial applications in extreme climates.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring secure connections.

Terminal Position: DUAL

Dual terminal positions allow for flexible routing and connections, enhancing design adaptability.

Maximum Seated Height: 0.5 mm

A low seated height optimizes the profile on the PCB, contributing to thinner product design.

Width: 1 mm

The compact width aids in the miniaturization of electronic devices, making this part ideal for modern applications.

Length: 1.45 mm

Short length also contributes to overall size reduction, which is critical in space-constrained environments.

Temperature Grade: AUTOMOTIVE

Automotive grade classification ensures reliability and performance in automotive applications and compliance with industry standards.

Terminal Form: NO LEAD

Lead-free design aligns with environmental regulations and enhances safety in various applications.

Telecom IC Type: INTERFACE CIRCUIT

Being an interface circuit type facilitates efficient data transfer, making it ideal for networking applications.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage ensures lower power consumption, enhancing energy efficiency in devices.

Terminal Pitch: 0.5 mm

A compact terminal pitch allows for denser arrangements of components, saving space on the PCB.

Technical Specifications

Network Interfaces NTS0101GM attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NTS0101GM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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