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NTS0104BQ

NXP Semiconductors

NTS0104BQ by NXP Semiconductors

The NXP Semiconductors NTS0104BQ is a Network Interfaces chip with 4 functions, operating b/w -40 to 125°C. It features a quad-terminal position, nickel palladium gold finish, and is designed for automotive applications requiring a 3.3V supply voltage.

Median Price

$0.448

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 98 parts In-Stock

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$0.448

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Digiode

USA . 2,918 parts In-Stock

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Vyrian

USA . 807 parts In-Stock

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Anansix

USA . 226 parts In-Stock

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Cyclops Electronics Ltd

UK . 3 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,799 parts In-Stock

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$0.448

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$0.439

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Argo Parts USA

USA . 1,559 parts In-Stock

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$0.448

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$0.435

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AZTECH Wire

Italy . 524 parts In-Stock

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$13.871

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Corohmni

South Africa . 285 parts In-Stock

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$15.644

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Aztec Data Supply Inc.

USA . 2,068 parts In-Stock

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$15.830

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One Stop Electronics

USA . 420 parts In-Stock

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$707.000

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Ampacity Inc.

Singapore . 891 parts In-Stock

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$973.000

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A-Z Elektronik GmbH

Germany . 14,741 parts In-Stock

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Lixinc

USA . 5,652 parts In-Stock

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UNI Independent Distributors

Spain . 3,388 parts In-Stock

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Formix International (Excess)

India . 1,880 parts In-Stock

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Infinite Electronics LLP (Excess)

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Corphita

USA . 1,199 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$0.439

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$0.426

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$0.417

100

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$0.439

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$0.417

Overview

Looking to enhance your networking capabilities? Look no further than the NTS0104BQ by NXP Semiconductors. With a reputation for top-quality products, NXP Semiconductors delivers on reliability and performance. This interface circuit offers versatile applications and seamless integration into various systems. Experience the value of streamlined connectivity, improved efficiency, and enhanced functionality with the NTS0104BQ. Upgrade your networking experience today with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the network interface, ensuring a longer lifespan.

Surface Mount: YES

Surface mount installation makes the product easy to integrate into existing systems, saving time and effort during setup.

No. of Functions: 4

Having multiple functions in one device reduces the need for additional components, streamlining the network setup.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this network interface can withstand harsh environmental conditions without compromising performance.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures energy efficiency and compatibility with a wide range of systems.

Technical Specifications

Network Interfaces NTS0104BQ attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PQCC-N14

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

2.5 mm

Trade Compliance

NTS0104BQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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