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NTS0101GV

NXP Semiconductors

NTS0101GV by NXP Semiconductors

NTS0101GV by NXP Semiconductors is a compact network interface IC designed for automotive applications. It operates within -40 °C to 125 °C, features a 1.8V supply voltage, and has a small outline with 6 gull-wing terminals. Ideal for reliable telecom interfacing in constrained spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,694 parts In-Stock

1+ parts

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4,694

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Digiode

USA . 1,525 parts In-Stock

1+ parts

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1k+ parts

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1,525

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Anansix

USA . 442 parts In-Stock

1+ parts

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442

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 858 parts In-Stock

1+ parts

$549.000

100+ parts

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858

$549.000

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UNI Independent Distributors

Spain . 6,387 parts In-Stock

1+ parts

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6,387

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Corphita

USA . 2,278 parts In-Stock

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2,278

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Overview

Elevate your connectivity solutions with the NTS0101GV from NXP Semiconductors, a leader in innovation and quality. Crafted for automotive applications, this robust network interface offers exceptional performance across extreme temperatures, ensuring reliable operation in any environment. With its compact design and superior reliability, the NTS0101GV simplifies integration and enhances efficiency, empowering your projects to thrive while delivering unmatched value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and resilience against harsh environmental conditions.

Surface Mount: YES

Surface mount technology allows for a compact design, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape offers efficient use of PCB space, ideal for modern electronic designs.

No. of Terminals: 6

Having six terminals provides flexibility in circuit design and integration into various systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile enhance the component's fit in denser applications, promoting efficient layout.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product is capable of working in high-temperature environments, ensuring dependable performance.

Minimum Operating Temperature: -40 °C

Its ability to function at -40 °C makes it suitable for automotive and industrial applications in frigid conditions.

Terminal Position: DUAL

Dual terminal positioning helps in maintaining strong electrical connections, enhancing signal integrity.

Maximum Seated Height: 1.1 mm

A maximum seated height of 1.1 mm helps in reducing the profile of the device, contributing to a slimmer overall design.

Width: 1.5 mm

The narrow width allows for tighter component spacing on PCBs, perfect for compact electronics.

Length: 2.9 mm

At 2.9 mm in length, it fits well within small form factor devices, ensuring versatility in various designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive standards, this product guarantees high performance and reliability in automotive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability, making assembly simpler and more reliable.

Telecom IC Type: INTERFACE CIRCUIT

Being an interface circuit makes it an essential component for connecting different systems, ensuring smooth communication.

Nominal Supply Voltage: 1.8 V

Operating at a low nominal supply voltage of 1.8 V promotes energy efficiency, reducing power consumption in electronic devices.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm allows for finer pitch designs, making it suitable for advanced and compact applications.

Technical Specifications

Network Interfaces NTS0101GV attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.5 mm

Trade Compliance

NTS0101GV Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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